NCP1855
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4
Table 2. MAXIMUM RATINGS
Rating Symbol Value Unit
IN (Note 1) V
IN
−0.3 to +28 V
CAP (Note 1) V
CAP
−0.3 to +28 V
Power balls: SW, CBOOT (Note 1) V
PWR
−0.3 to +24 V
IN pin with respect to VCAP V
IN_CAP
−0.3 to +7.0 V
SW with respect to SW V
SW_CAP
−0.3 to +7.0 V
Sense/Control balls: SENSP, SENSN, VBAT, FET, TRANS, CORE,
FLAG, INTB and WEAK. (Note 1)
V
CTRL
−0.3 to +7.0 V
Digital Input: SCL, SDA, SPM, OTG, ILIM, FTRY (Note 1)
Input Voltage
Input Current
V
DG
I
DG
−0.3 to +7.0 V
20
V
mA
Storage Temperature Range T
STG
−65 to +150 °C
Maximum Junction Temperature (Note 4) T
J
−40 to +TSD °C
Moisture Sensitivity (Note 5) MSL Level 1
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
Table 3. OPERATING CONDITIONS
Symbol Parameter Conditions Min Typ Max Unit
V
IN
Operational Power Supply 3.6 V
INOV
V
V
DG
Digital input voltage level 0 5.5 V
T
A
Ambient Temperature Range −40 25 +85 °C
I
SINK
FLAG sink current 10 mA
C
IN
Decoupling input capacitor 1
mF
C
CAP
Decoupling Switcher capacitor 4.7
mF
C
CORE
Decoupling core supply capacitor 2.2
mF
C
OUT
Decoupling system capacitor 22
mF
L
X
Switcher Inductor 2.2
mH
R
SNS
Current sense resistor 33
mW
R
q
JA
Thermal Resistance Junction to Air (Notes 4 and 6) 70 °C/W
T
J
Junction Temperature Range −40 25 +125 °C
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
1. With Respect to PGND. According to JEDEC standard JESD22−A108.
2. This device series contains ESD protection and passes the following tests:
Human Body Model (HBM) ±2.0 kV per JEDEC standard: JESD22−A114 for all pins.
Machine Model (MM) ±200 V per JEDEC standard: JESD22−A115 for all pins.
3. Latch up Current Maximum Rating: ±100 mA or per ±10 mA JEDEC standard: JESD78 class II.
4. A thermal shutdown protection avoids irreversible damage on the device due to power dissipation. See Electrical Characteristics.
5. Moisture Sensitivity Level (MSL): 1 per IPC/JEDEC standard: J−STD−020.
6. The R
q
JA
is dependent on the PCB heat dissipation. Board used to drive this data was a 2s2p JEDEC PCB standard.