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PCA85134H/Q900/1,1

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P30P31-P33P34-P36P37-P39P40-P42P43-P45P46-P48P49-P51P52-P53
PCA85134 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 2 — 6 May 2014 43 of 53
NXP Semiconductors
PCA85134
Automotive 60 x 4 LCD segment driver for low multiplex rates
• Inspection and repair
• Lead-free soldering versus SnPb soldering
19.3 Wave soldering
Key characteristics in wave soldering are:
• Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
• Solder bath specifications, including temperature and impurities
19.4 Reflow soldering
Key characteristics in reflow soldering are:
• Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 25
) than a SnPb process, thus
reducing the process window
• Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
• Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 24
and 25
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 25
.
Table 24. SnPb eutectic process (from J-STD-020D)
Package thickness (mm) Package reflow temperature (C)
Volume (mm
3
)
< 350 350
< 2.5 235 220
2.5 220 220
Table 25. Lead-free process (from J-STD-020D)
Package thickness (mm) Package reflow temperature (C)
Volume (mm
3
)
< 350 350 to 2000 > 2000
< 1.6 260 260 260
1.6 to 2.5 260 250 245
> 2.5 250 245 245
PCA85134 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 2 — 6 May 2014 44 of 53
NXP Semiconductors
PCA85134
Automotive 60 x 4 LCD segment driver for low multiplex rates
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
MSL: Moisture Sensitivity Level
Fig 25. Temperature profiles for large and small components
001aac844
temperature
time
minimum peak temperature
= minimum soldering temperature
maximum peak temperature
= MSL limit, damage level
peak
temperature
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PCA85134 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 2 — 6 May 2014 45 of 53
NXP Semiconductors
PCA85134
Automotive 60 x 4 LCD segment driver for low multiplex rates
20. Appendix
20.1 LCD segment driver selection
Table 26. Selection of LCD segment drivers
Type name Number of elements at MUX V
DD
(V) V
LCD
(V) f
fr
(Hz) V
LCD
(V)
charge
pump
V
LCD
(V)
temperature
compensat.
T
amb
(C) Interface Package AEC-
Q100
1:1 1:2 1:3 1:4 1:6 1:8 1:9
PCA8553DTT 40 80 120 160 - - - 1.8 to 5.5 1.8 to 5.5 32 to 256
[1]
NN 40 to 105 I
2
C / SPI TSSOP56 Y
PCA8546ATT - - - 176 - - - 1.8 to 5.5 2.5 to 9 60 to 300
[1]
NN 40 to 95 I
2
C TSSOP56 Y
PCA8546BTT - - - 176 - - - 1.8 to 5.5 2.5 to 9 60 to 300
[1]
NN 40 to 95 SPI TSSOP56 Y
PCA8547AHT 44 88 - 176 - - - 1.8 to 5.5 2.5 to 9 60 to 300
[1]
YY 40 to 95 I
2
CTQFP64Y
PCA8547BHT 44 88 - 176 - - - 1.8 to 5.5 2.5 to 9 60 to 300
[1]
YY 40 to 95 SPI TQFP64 Y
PCF85134HL 60 120 180 240 - - - 1.8 to 5.5 2.5 to 6.5 82 N N 40 to 85 I
2
CLQFP80N
PCA85134H 60 120 180 240 - - - 1.8 to 5.5 2.5 to 8 82 N N 40 to 95 I
2
CLQFP80Y
PCA8543AHL 60 120 - 240 - - - 2.5 to 5.5 2.5 to 9 60 to 300
[1]
YY 40 to 105 I
2
CLQFP80Y
PCF8545ATT - - - 176 252 320 - 1.8 to 5.5 2.5 to 5.5 60 to 300
[1]
NN 40 to 85 I
2
C TSSOP56 N
PCF8545BTT - - - 176 252 320 - 1.8 to 5.5 2.5 to 5.5 60 to 300
[1]
NN 40 to 85 SPI TSSOP56 N
PCF8536AT - - - 176 252 320 - 1.8 to 5.5 2.5 to 9 60 to 300
[1]
NN 40 to 85 I
2
C TSSOP56 N
PCF8536BT - - - 176 252 320 - 1.8 to 5.5 2.5 to 9 60 to 300
[1]
NN 40 to 85 SPI TSSOP56 N
PCA8536AT - - - 176 252 320 - 1.8 to 5.5 2.5 to 9 60 to 300
[1]
NN 40 to 95 I
2
C TSSOP56 Y
PCA8536BT - - - 176 252 320 - 1.8 to 5.5 2.5 to 9 60 to 300
[1]
NN 40 to 95 SPI TSSOP56 Y
PCF8537AH 44 88 - 176 276 352 - 1.8 to 5.5 2.5 to 9 60 to 300
[1]
YY 40 to 85 I
2
CTQFP64N
PCF8537BH 44 88 - 176 276 352 - 1.8 to 5.5 2.5 to 9 60 to 300
[1]
YY 40 to 85 SPI TQFP64 N
PCA8537AH 44 88 - 176 276 352 - 1.8 to 5.5 2.5 to 9 60 to 300
[1]
YY 40 to 95 I
2
CTQFP64Y
PCA8537BH 44 88 - 176 276 352 - 1.8 to 5.5 2.5 to 9 60 to 300
[1]
YY 40 to 95 SPI TQFP64 Y
PCA9620H 60 120 - 240 320 480 - 2.5 to 5.5 2.5 to 9 60 to 300
[1]
YY 40 to 105 I
2
CLQFP80Y
PCA9620U 60 120 - 240 320 480 - 2.5 to 5.5 2.5 to 9 60 to 300
[1]
YY 40 to 105 I
2
C Bare die Y
PCF8576DU 40 80 120 160 - - - 1.8 to 5.5 2.5 to 6.5 77 N N 40 to 85 I
2
C Bare die N
PCF8576EUG 40 80 120 160 - - - 1.8 to 5.5 2.5 to 6.5 77 N N 40 to 85 I
2
C Bare die N
PCA8576FUG 40 80 120 160 - - - 1.8 to 5.5 2.5 to 8 200 N N 40 to 105 I
2
C Bare die Y
PCF85133U 80 160 240 320 - - - 1.8 to 5.5 2.5 to 6.5 82, 110
[2]
NN 40 to 85 I
2
C Bare die N
PCA85133U 80 160 240 320 - - - 1.8 to 5.5 2.5 to 8 82, 110
[2]
NN 40 to 95 I
2
C Bare die Y
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P30P31-P33P34-P36P37-P39P40-P42P43-P45P46-P48P49-P51P52-P53

PCA85134H/Q900/1,1

Mfr. #:
Buy PCA85134H/Q900/1,1
Manufacturer:
NXP Semiconductors
Description:
LCD Drivers 60 X 4 LCD DRIVER FOR MULTIPLEX RATES
Lifecycle:
New from this manufacturer.
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