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P89LPC9103FTK,115
P1-P3
P4-P6
P7-P9
P10-P12
P13-P15
P16-P18
P19-P21
P22-P24
P25-P27
P28-P30
P31-P33
P34-P36
P37-P39
P40-P42
P43-P45
P46-P48
P49-P51
P52-P54
P55-P57
P58-P60
P61-P61
P89LPC9102_9103_9107_3
© NXP B.V
. 2007. All rights reser
ved.
Product data sheet
Rev
. 03 — 10 July 2007
55 of 61
NXP Semiconductors
P89LPC9102/9103/9107
8-bit microcontr
ollers with tw
o-clock accelerated 80C51 core
Fig 22.
P
ackage outline SO
T402-1 (TSSOP14)
UNIT
A
1
A
2
A
3
b
p
cD
(1)
E
(2)
(1)
eH
E
LL
p
QZ
y
w
v
θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
mm
0.15
0.05
0.95
0.80
0.30
0.19
0.2
0.1
5.1
4.9
4.5
4.3
0.65
6.6
6.2
0.4
0.3
0.72
0.38
8
0
o
o
0.13
0.1
0.2
1
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
0.75
0.50
SOT402-1
MO-153
99-12-27
03-02-18
w
M
b
p
D
Z
e
0.25
17
14
8
θ
A
A
1
A
2
L
p
Q
detail X
L
(A )
3
H
E
E
c
v
M
A
X
A
y
0
2.5
5 mm
scale
TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4.4 mm
SOT402-1
A
max.
1.1
pin 1 index
P89LPC9102_9103_9107_3
© NXP B.V
. 2007. All rights reser
ved.
Product data sheet
Rev
. 03 — 10 July 2007
56 of 61
NXP Semiconductors
P89LPC9102/9103/9107
8-bit microcontr
ollers with tw
o-clock accelerated 80C51 core
Fig 23.
P
ackage outline SO
T27-1 (DIP14)
UNIT
A
max.
1
2
(1)
(1)
b
1
cD
(1)
Z
Ee
M
H
L
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
mm
inches
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
SOT27-1
99-12-27
03-02-13
A
min.
A
max.
b
max.
w
M
E
e
1
1.73
1.13
0.53
0.38
0.36
0.23
19.50
18.55
6.48
6.20
3.60
3.05
0.254
2.54
7.62
8.25
7.80
10.0
8.3
2.2
4.2
0.51
3.2
0.068
0.044
0.021
0.015
0.77
0.73
0.014
0.009
0.26
0.24
0.14
0.12
0.01
0.1
0.3
0.32
0.31
0.39
0.33
0.087
0.17
0.02
0.13
050G04
MO-001
SC-501-14
M
H
c
(e )
1
M
E
A
L
seating plane
A
1
w
M
b
1
e
D
A
2
Z
14
1
8
7
b
E
pin 1 index
0
5
10 mm
scale
Note
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
DIP14: plastic dual in-line package; 14 leads (300 mil)
SOT27-1
P89LPC9102_9103_9107_3
© NXP B.V
. 2007. All rights reser
ved.
Product data sheet
Rev
. 03 — 10 July 2007
57 of 61
NXP Semiconductors
P89LPC9102/9103/9107
8-bit microcontr
ollers with tw
o-clock accelerated 80C51 core
15.
Abbreviations
T
able 17.
Acr
onym list
Acron
ym
Description
A/D
Analog-to-Digital
BOE
Brownout Enab
le
CMRR
Common-Mode Rejection Ratio
D
AC
Digital-to-Analog Conv
er
ter
EMI
Electromagnetic Interf
erence
IAP
In-Application Programming
ICP
In-Circuit Prog
ramming
LSB
Least Significant Bit
MSB
Most Significant Bit
PWM
Pulse Width Modulator
R
TC
Real-Time Clock
SAR
Successive Appro
ximation Register
U
ART
Universal Asynchronous Receiv
er/T
ransmitter
P1-P3
P4-P6
P7-P9
P10-P12
P13-P15
P16-P18
P19-P21
P22-P24
P25-P27
P28-P30
P31-P33
P34-P36
P37-P39
P40-P42
P43-P45
P46-P48
P49-P51
P52-P54
P55-P57
P58-P60
P61-P61
P89LPC9103FTK,115
Mfr. #:
Buy P89LPC9103FTK,115
Manufacturer:
NXP Semiconductors
Description:
IC MCU 8BIT 1KB FLASH 10HVSON
Lifecycle:
New from this manufacturer.
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