TDA8920C_2 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 02 — 11 June 2009 19 of 39
NXP Semiconductors
TDA8920C
2 × 110 W class-D power amplifier
13.5 Heatsink requirements
An external heatsink must be connected to the TDA8920C.
Equation 5 defines the relationship between maximum power dissipation before activation
of TFB and total thermal resistance from junction to ambient.
(5)
Power dissipation (P) is determined by the efficiency of the TDA8920C. Efficiency
measured as a function of output power is given in Figure 20. Power dissipation can be
derived as a function of output power as shown in Figure 19.
(1) R
th(j-a)
= 5 K/W.
(2) R
th(j-a)
= 10 K/W.
(3) R
th(j-a)
= 15 K/W.
(4) R
th(j-a)
= 20 K/W.
(5) R
th(j-a)
= 35 K/W.
Fig 9. Derating curves for power dissipation as a function of maximum ambient
temperature
R
th
ja()
T
j
T
amb
P
------------------------
=
P
(W)
30
20
10
0
T
amb
(°C)
(1)
(2)
(3)
(4)
(5)
0 20 10040 60 80
mbl469
TDA8920C_2 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 02 — 11 June 2009 20 of 39
NXP Semiconductors
TDA8920C
2 × 110 W class-D power amplifier
In the following example, a heatsink calculation is made for an 8 BTL application with a
±30 V supply:
The audio signal has a crest factor of 10 (the ratio between peak power and average
power (20 dB)); this means that the average output power is
1
10
of the peak power.
Thus, the peak RMS output power level is the 0.5 % THD level, i.e. 170 W.
The average power is then
1
10
× 170W=17W.
The dissipated power at an output power of 17 W is approximately 7 W.
When the maximum expected ambient temperature is 50 °C, the total R
th(j-a)
becomes
R
th(j-a)
= R
th(j-c)
+ R
th(c-h)
+ R
th(h-a)
R
th(j-c)
(thermal resistance from junction to case) = 1.1 K/W
R
th(c-h)
(thermal resistance from case to heatsink) = 0.5 K/W to 1 K/W (dependent on
mounting)
So the thermal resistance between heatsink and ambient temperature is:
R
th(h-a)
(thermal resistance from heatsink to ambient) = 14 (1.1 + 1) = 11.9 K/W
The derating curves for power dissipation (for several R
th(j-a)
values) are illustrated in
Figure 9. A maximum junction temperature T
j
= 150 °C is taken into account. The
maximum allowable power dissipation for a given heatsink size can be derived, or the
required heatsink size can be determined, at a required power dissipation level; see
Figure 9.
13.6 Pumping effects
In a typical stereo single-ended configuration, the TDA8920C is supplied by a symmetrical
supply voltage (e.g. V
DD
= 30 V and V
SS
= 30 V). When the amplifier is used in an SE
configuration, a ‘pumping effect’ can occur. During one switching interval, energy is taken
from one supply (e.g. V
DD
), while a part of that energy is returned to the other supply line
(e.g. V
SS
) and vice versa. When the voltage supply source cannot sink energy, the voltage
across the output capacitors of that voltage supply source increases and the supply
voltage is pumped to higher levels. The voltage increase caused by the pumping effect
depends on:
Speaker impedance
Supply voltage
Audio signal frequency
Value of supply line decoupling capacitors
Source and sink currents of other channels
Pumping effects should be minimized to prevent the malfunctioning of the audio amplifier
and/or the voltage supply source. Amplifier malfunction due to the pumping effect can
trigger UVP, OVP or UBP.
148 50()
7
-------------------------
14 K/W=
TDA8920C_2 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 02 — 11 June 2009 21 of 39
NXP Semiconductors
TDA8920C
2 × 110 W class-D power amplifier
The most effective way to avoid pumping effects is to connect the TDA8920C in a mono
full-bridge configuration. In the case of stereo single-ended applications, it is advised to
connect the inputs in anti-phase (see Section 8.4 on page 11). The power supply can also
be adapted; for example, by increasing the values of the supply line decoupling
capacitors.
13.7 Application schematic
Notes on the application schematic:
Connect a solid ground plane around the switching amplifier to avoid emissions
Place 100 nF capacitors as close as possible to the TDA8920C power supply pins
Connect the heatsink to the ground plane or to VSSPn using a 100 nF capacitor
Use a thermally conductive, electrically non-conductive, Sil-Pad between the
TDA8920C heat spreader and the external heatsink
The heat spreader of the TDA8920C is internally connected to VSSD
Use differential inputs for the most effective system level audio performance with
unbalanced signal sources. In case of hum due to floating inputs, connect the
shielding or source ground to the amplifier ground.

TDA8920CJ/N1,112

Mfr. #:
Manufacturer:
NXP Semiconductors
Description:
Audio Amplifiers Audio Amp Speaker 1CH Mono/2-CH Stereo
Lifecycle:
New from this manufacturer.
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