TDA8920C_2 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 02 — 11 June 2009 37 of 39
NXP Semiconductors
TDA8920C
2 × 110 W class-D power amplifier
16.4 Package related soldering information
[1] For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit
board.
[2] For PMFP packages hot bar soldering or manual soldering is suitable.
17. Revision history
Table 14. Suitability of through-hole mount IC packages for dipping and wave soldering
Package Soldering method
Dipping Wave
CPGA, HCPGA - suitable
DBS, DIP, HDIP, RDBS, SDIP, SIL suitable suitable
[1]
PMFP
[2]
- not suitable
Table 15. Revision history
Document ID Release date Data sheet status Change notice Supersedes
TDA8920C_2 20090611 Product data sheet TDA8920C_1
Modifications
Parameter values revised throughout.
Revised Figure 4 and Figure 10.
Graphs updated (Figure 11 to Figure 27)
Some minor additions/corrections to text
TDA8920C_1 20080929 Preliminary data sheet - -
TDA8920C_2 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 02 — 11 June 2009 38 of 39
NXP Semiconductors
TDA8920C
2 × 110 W class-D power amplifier
18. Legal information
18.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL
http://www.nxp.com.
18.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
18.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at
http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
18.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
19. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Document status
[1][2]
Product status
[3]
Definition
Objective [short] data sheet Development This document contains data from the objective specification for product development.
Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.
Product [short] data sheet Production This document contains the product specification.
NXP Semiconductors
TDA8920C
2 × 110 W class-D power amplifier
© NXP B.V. 2009. All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 11 June 2009
Document identifier: TDA8920C_2
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
20. Contents
1 General description . . . . . . . . . . . . . . . . . . . . . . 1
2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
4 Quick reference data . . . . . . . . . . . . . . . . . . . . . 2
5 Ordering information . . . . . . . . . . . . . . . . . . . . . 2
6 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
7 Pinning information. . . . . . . . . . . . . . . . . . . . . . 4
7.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
7.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5
8 Functional description . . . . . . . . . . . . . . . . . . . 5
8.1 General. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
8.2 Pulse-width modulation frequency . . . . . . . . . . 8
8.3 Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
8.3.1 Thermal protection . . . . . . . . . . . . . . . . . . . . . . 8
8.3.1.1 Thermal FoldBack (TFB) . . . . . . . . . . . . . . . . . 8
8.3.1.2 OverTemperature Protection (OTP) . . . . . . . . . 9
8.3.2 OverCurrent Protection (OCP) . . . . . . . . . . . . . 9
8.3.3 Window Protection (WP). . . . . . . . . . . . . . . . . 10
8.3.4 Supply voltage protection . . . . . . . . . . . . . . . . 11
8.4 Differential audio inputs . . . . . . . . . . . . . . . . . 11
9 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 12
10 Thermal characteristics. . . . . . . . . . . . . . . . . . 12
11 Static characteristics. . . . . . . . . . . . . . . . . . . . 13
12 Dynamic characteristics . . . . . . . . . . . . . . . . . 14
12.1 Switching characteristics . . . . . . . . . . . . . . . . 14
12.2 Stereo SE configuration characteristics . . . . . 15
12.3 Mono BTL application characteristics. . . . . . . 16
13 Application information. . . . . . . . . . . . . . . . . . 17
13.1 Mono BTL application. . . . . . . . . . . . . . . . . . . 17
13.2 Pin MODE. . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
13.3 Estimating the output power . . . . . . . . . . . . . . 17
13.3.1 Single-Ended (SE) . . . . . . . . . . . . . . . . . . . . . 17
13.3.2 Bridge-Tied Load (BTL) . . . . . . . . . . . . . . . . . 18
13.4 External clock . . . . . . . . . . . . . . . . . . . . . . . . . 18
13.5 Heatsink requirements . . . . . . . . . . . . . . . . . . 19
13.6 Pumping effects . . . . . . . . . . . . . . . . . . . . . . . 20
13.7 Application schematic. . . . . . . . . . . . . . . . . . . 21
13.8 Curves measured in reference design . . . . . . 23
14 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 32
15 Soldering of SMD packages . . . . . . . . . . . . . . 34
15.1 Introduction to soldering . . . . . . . . . . . . . . . . . 34
15.2 Wave and reflow soldering . . . . . . . . . . . . . . . 34
15.3 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 34
15.4 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 35
16 Soldering of through-hole mount packages . 36
16.1 Introduction to soldering through-hole mount
packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
16.2 Soldering by dipping or by solder wave . . . . . 36
16.3 Manual soldering . . . . . . . . . . . . . . . . . . . . . . 36
16.4 Package related soldering information. . . . . . 37
17 Revision history . . . . . . . . . . . . . . . . . . . . . . . 37
18 Legal information . . . . . . . . . . . . . . . . . . . . . . 38
18.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 38
18.2 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
18.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 38
18.4 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 38
19 Contact information . . . . . . . . . . . . . . . . . . . . 38
20 Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39

TDA8920CJ/N1,112

Mfr. #:
Manufacturer:
NXP Semiconductors
Description:
Audio Amplifiers Audio Amp Speaker 1CH Mono/2-CH Stereo
Lifecycle:
New from this manufacturer.
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