©2011 Silicon Storage Technology, Inc. DS25085A 10/11
40
8 Mbit Firmware Hub
SST49LF008A
Data Sheet
A
Microchip Technology Company
Product Ordering Information
Valid combinations for SST49LF008A
SST49LF008A-33-4C-WHE SST49LF008A-33-4C-NHE SST49LF008A-33-4C-EIE
Note:Valid combinations are those products in mass production or will be in mass production. Consult your SST
sales representative to confirm availability of valid combinations and to determine availability of new combi-
nations.
SST 49 LF 008A - 33 - 4C - EIE
XX XX XXXX - XX - XX
-
XXX
Environmental Attribute
E
1
= non-Pb
Package Modifier
H = 32 leads
I = 40 leads
Package Type
N = PLCC
W = TSOP (type 1, die up, 8mm x
14mm)
E = TSOP (type 1, die up, 10mm x
20mm)
Operating Temperature
C = Commercial = 0°C to +85°C
Minimum Endurance
4 = 10,000 cycles
Serial Access Clock Frequency
33 = 33 MHz
Version
A = Second Version
Device Density
008 = 8 Mbit
Voltage Range
L = 3.0-3.6V
Product Series
49 = Firmware Hub for Intel 8xx Chip-
sets
1. Environmental suffix “E” denotes non-Pb solder.
SST non-Pb solder devices are “RoHS Compliant”.
©2011 Silicon Storage Technology, Inc. DS25085A 10/11
41
8 Mbit Firmware Hub
SST49LF008A
Data Sheet
A
Microchip Technology Company
Packaging Diagrams
Figure 29:32-lead Plastic Lead Chip Carrier (PLCC)
SST Package Code: NH
.040
.030
.021
.013
.530
.490
.095
.075
.140
.125
.032
.026
.032
.026
.029
.023
.453
.447
.553
.547
.595
.585
.495
.485
.112
.106
.042
.048
.048
.042
.015 Min.
TOP VIEW SIDE VIEW BOTTOM VIEW
1232
.400
BSC
32-plcc-NH-3
Note: 1. Complies with JEDEC publication 95 MS-016 AE dimensions, although some dimensions may be more stringent.
2. All linear dimensions are in inches (max/min).
3. Dimensions do not include mold flash. Maximum allowable mold flash is .008 inches.
4. Coplanarity: 4 mils.
.050
BSC
.050
BSC
Optional
Pin #1
Identifier
.020 R.
MAX.
R.
x30°
©2011 Silicon Storage Technology, Inc. DS25085A 10/11
42
8 Mbit Firmware Hub
SST49LF008A
Data Sheet
A
Microchip Technology Company
Figure 30:32-lead Thin Small Outline Package (TSOP) 8mm x 14mm
SST Package Code: WH
32-tsop-WH-7
Note: 1. Complies with JEDEC publication 95 MO-142 BA dimensions,
although some dimensions may be more stringent.
2. All linear dimensions are in millimeters (max/min).
3. Coplanarity: 0.1 mm
4. Maximum allowable mold flash is 0.15 mm at the package ends, and 0.25 mm between leads.
1.20
max.
1mm
Pin # 1 Identifier
12.50
12.30
14.20
13.80
0.70
0.50
8.10
7.90
0.27
0.17
0.50
BSC
1.05
0.95
0.15
0.05
0.70
0.50
0°-
DETAIL

SST49LF008A-33-4C-NHE

Mfr. #:
Manufacturer:
Microchip Technology
Description:
NOR Flash 8M (1Mx8) 33MHz Commercial Temp
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union