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SE97TK,118

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P30P31-P33P34-P36P37-P39P40-P42P43-P45P46-P48P49-P51P52-P54P55-P55
SE97_7 © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 07 — 29 January 2010 46 of 55
NXP Semiconductors
SE97
DDR memory module temp sensor with integrated SPD, 3.3 V
Fig 42. Package outline SOT908-1 (HVSON8)
0.50.21
0.05
0.00
A
1
E
h
b
UNIT
D
(1)
ye
1.5
e
1
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
mm
3.1
2.9
cD
h
1.65
1.35
y
1
3.1
2.9
2.25
1.95
0.3
0.2
0.05 0.1
DIMENSIONS (mm are the original dimensions)
SOT908-1 MO-229
E
(1)
0.5
0.3
L
0.1
v
0.05
w
SOT908-1
H
VSON8: plastic thermal enhanced very thin small outline package; no leads;
8
terminals; body 3 x 3 x 0.85 mm
A
(1)
max.
05-09-26
05-10-05
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
X
terminal 1
index area
B A
D
E
detail X
A
A
1
c
C
y
C
y
1
exposed tie bar (4×)
exposed tie bar (4×)
b
terminal 1
index area
e
1
e
AC
B
v
M
C w
M
E
h
D
h
L
14
58
0 1 2 mm
scale
SE97_7 © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 07 — 29 January 2010 47 of 55
NXP Semiconductors
SE97
DDR memory module temp sensor with integrated SPD, 3.3 V
Fig 43. Package outline SOT1052-1 (HXSON8)
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
SOT1052-1 MO-229
SOT1052-
1
Note
1. Dimension A is including plating thickness. The package footprint is compatible with JEDEC MO229
DIMENSIONS (mm are the original dimensions)
H
XSON8: plastic thermal enhanced extremely thin small outline package; no leads;
8
terminals; body 2 x 3 x 0.5 mm
UNIT
mm
max
nom
min
0.5 0.04 2.1
2.0
1.9
1.6
1.4
0.5
3.1
3.0
2.9
1.6
1.4
0.45
0.35
0.3
0.2
0.1 0.05 0.05
A
(1)
A
1
b D D
1
E E
1
e L v y y
1
0 1 2 mm
scale
terminal 1
index area
D
h
e
1/2 e
E
h
L
85
14
B
A
D
E
terminal 1
index area
X
BAb v
M
detail X
A
A
1
C
y
1
C
y
(8×)
08-01-11
08-03-11
SE97_7 © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 07 — 29 January 2010 48 of 55
NXP Semiconductors
SE97
DDR memory module temp sensor with integrated SPD, 3.3 V
Fig 44. Package outline SOT1069-1 (HWSON8)
References
Outline
version
European
projection
Issue date
IEC JEDEC JEITA
SOT1069-1
MO-229
sot1069-1_po
08-07-10
09-08-10
Unit
mm
max
nom
min
0.80
0.75
0.70
0.05
0.02
0
0.2
0.30
0.25
0.20
2.1
2.0
1.9
1.6
1.4
1.6
1.4
0.5
0.45
0.35
A
(1)
Dimensions
Note
1. Dimension A is including plating thickness. The package footprint is compatible with JEDEC MO229
H
WSON8: plastic thermal enhanced very very thin small outline package; no leads;
8
terminals; body 2 x 3 x 0.8 mm
SOT1069-
1
A
1
A
2
0.65
0.55
0.45
A
3
bDD
2
E
3.1
3.0
2.9
E
2
eK
0.2
Lv
0.1
y
0.05
y
1
0.05
0 1 2 mm
scale
B
A
D
E
terminal 1
index area
X
BAb v
C
y
1
C
y
(8×)
detail X
A
A
3
A
1
A
2
terminal 1
index area
D
2
e
1/2 e
E
2
L
85
14
K
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P30P31-P33P34-P36P37-P39P40-P42P43-P45P46-P48P49-P51P52-P54P55-P55

SE97TK,118

Mfr. #:
Buy SE97TK,118
Manufacturer:
NXP Semiconductors
Description:
IC TEMP SENSOR DIMM 8-HVSON
Lifecycle:
New from this manufacturer.
Delivery:
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