MPC8306S PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 1
44 Freescale Semiconductor
Package and Pin Listings
19 Package and Pin Listings
This section details package parameters, pin assignments, and dimensions. The MPC8306S is available in
a thermally enhanced MAPBGA (mold array process-ball grid array); see Section 19.1, “Package
Parameters for the MPC8306S,” and Section 19.2, “Mechanical Dimensions of the MPC8306S
MAPBGA,” for information on the MAPBGA.
19.1 Package Parameters for the MPC8306S
The package parameters are as provided in the following list.
Package outline 19 mm 19 mm
Package Type MAPBGA
Interconnects 369
Pitch 0.80 mm
Module height (typical) 1.48 mm; Min = 1.31mm and Max 1.61mm
Solder Balls 96 Sn / 3.5 Ag / 0.5 Cu (VM package)
Ball diameter (typical) 0.40 mm
19.2 Mechanical Dimensions of the MPC8306S MAPBGA
The following figure shows the mechanical dimensions and bottom surface nomenclature of the
MPC8306S, 369-MAPBGA package.
