UJA1075_2 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 02 — 27 May 2010 28 of 53
NXP Semiconductors
UJA1075
High-speed CAN/LIN core system basis chip
7. Limiting values
Table 8. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
V
x
voltage on pin x DC value
pins V1, V2 and INTN 0.3 7 V
pins TXDC, RXDC, EN, SDI, SDO, SCK, SCSN,
TXDL, RXDL, RSTN and WDOFF
0.3 V
V1
+ 0.3 V
pin VEXCC V
V1
0.3 V
V1
+ 0.35 V
pins WAKE1, WAKE2 and WBIAS; with respect to
any other pin
58 +58 V
pin LIMP and BAT 0.3 +40 V
pin VEXCTRL 0.3 V
BAT
+ 0.3 V
pins CANH, CANL, SPLIT and LIN; with respect to
any other pin
58 +58 V
pin DLIN; with respect to any other pin V
BAT
0.3 +58 V
I
R(V1-BAT)
reverse current from
pin V1 to pin BAT
V
V1
5V
[1]
- 250 mA
I
DLIN
current on pin DLIN 65 0 mA
V
trt
transient voltage on pins
BAT: via reverse polarity diode/capacitor
CANL, CANH, SPLIT: coupling with two capacitors
on the bus lines
LIN: coupling via 1 nF capacitor
DLIN: via 1 kΩ resistor
[2]
150 +100 V
V
ESD
electrostatic
discharge voltage
IEC 61000-4-2
[3]
pins BAT with capacitor, CANH, CANL and LIN; via
a series resistor on pins SPLIT, DLIN, WAKE1 and
WAKE2
[4]
6+6kV
HBM
[5]
pins CANH, CANL, LIN, SPLIT, DLIN, WAKE1 and
WAKE2
[6]
8+8kV
pin BAT; referenced to ground 4+4kV
pin TEST2; referenced to pin BAT 1.25 +2 kV
pin TEST2; referenced to other reference pins 2+2kV
any other pin 2+2kV
MM
[7]
any pin 300 +300 V
CDM
[8]
corner pins 750 +750 V
any other pin 500 +500 V
T
vj
virtual junction
temperature
[9]
40 +150 °C
T
stg
storage temperature 55 +150 °C
UJA1075_2 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 02 — 27 May 2010 29 of 53
NXP Semiconductors
UJA1075
High-speed CAN/LIN core system basis chip
[1] A reverse diode connected between V1 (anode) and BAT (cathode) limits the voltage drop voltage from V1(+) to BAT (-).
[2] Verified by an external test house to ensure pins can withstand ISO 7637 part 2 automotive transient test pulses 1, 2a, 3a and 3b.
[3] IEC 61000-4-2 (150 pF, 330 Ω).
[4] ESD performance according to IEC 61000-4-2 (150 pF, 330 Ω) has been verified by an external test house for pins BAT, CANH, CANL,
LIN1, LIN2, WAKE1 and WAKE2. The result is equal to or better than ±6 kV.
[5] Human Body Model (HBM): according to AEC-Q100-002 (100 pF, 1.5 kΩ).
[6] V1, V2 and BAT connected to GND, emulating application circuit.
[7] Machine Model (MM): according to AEC-Q100-003 (200 pF, 0.75 μH, 10 Ω).
[8] Charged Device Model (CDM): according to AEC-Q100-011 (field Induced charge; 4 pF).
[9] In accordance with IEC 60747-1. An alternative definition of virtual junction temperature is: T
vj
=T
amb
+P× R
th(vj-a)
, where R
th(vj-a)
is a
fixed value to be used for the calculation of T
vj
. The rating for T
vj
limits the allowable combinations of power dissipation (P) and ambient
temperature (T
amb
).
T
amb
ambient
temperature
40 +125 °C
Table 8. Limiting values …continued
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
UJA1075_2 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 02 — 27 May 2010 30 of 53
NXP Semiconductors
UJA1075
High-speed CAN/LIN core system basis chip
8. Thermal characteristics
Layout conditions for R
th(j-a)
measurements: board finish thickness 1.6 mm ±10 %, double-layer
board, board dimensions 129 mm × 60 mm, board Material FR4, Cu thickness 0.070 mm, thermal
via separation 1.2 mm, thermal via diameter 0.3 mm ±0.08 mm, Cu thickness on vias 0.025 mm.
Optional heat sink top layer of 3.5 mm × 25 mm will reduce thermal resistance (see Figure 14
).
Fig 13. HTSSOP PCB
PCB copper area:
(bottom layer)
2 cm
2
PCB copper area:
(bottom layer)
8 cm
2
015aaa137
optional heatsink top layer
optional heatsink top layer
optional heatsink top layer

UJA1075TW/3V3,112

Mfr. #:
Manufacturer:
NXP Semiconductors
Description:
IC SBC CAN/LIN HS 3.3V 32HTSSOP
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
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