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SL2S2102FUD,003

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P30P31-P33P34-P36P37-P39
NXP Semiconductors
SL2S2002_SL2S2102
ICODE SLIX
SL2S2002_SL2S2102 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2017. All rights reserved.
Product data sheet Rev. 3.4 — 10 August 2017
COMPANY PUBLIC 178034 28 / 39
13 Package outline
References
Outline
version
European
projection
Issue date
IEC JEDEC JEITA
SOT1122
MO-252
sot1122_po
Unit
mm
max
nom
min
0.50 0.04
0.55 0.425
0.30
0.25
0.22
0.35
0.30
0.27
A
(1)
Dimensions
Notes
1. Dimension A is including plating thickness.
2. Can be visible in some manufacturing processes.
SOT1122
A
1
D
1.50
1.45
1.40
1.05
1.00
0.95
E e e
1
0.55
0.50
0.47
0.45
0.40
0.37
b b
1
L L
1
09-10-09
XSON3: plastic extremely thin small outline package; no leads; 3 terminals; body 1 x 1.45 x 0.5 mm
D
E
e
1
e
A
1
b
1
L
1
L
e
1
0 1 2 mm
scale
3
1
2
b
4×
(2)
4×
(2)
A
pin 1 indication
type code
terminal 1
index area
Figure 6. Package outline SOT1122
NXP Semiconductors
SL2S2002_SL2S2102
ICODE SLIX
SL2S2002_SL2S2102 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2017. All rights reserved.
Product data sheet Rev. 3.4 — 10 August 2017
COMPANY PUBLIC 178034 29 / 39
References
Outline
version
European
projection
Issue date
IEC JEDEC JEITA
SOT500-4 - - -
- - -
- - -
sot500-4_po
11-02-18
Unit
mm
max
nom
min
0.26 35.05
35.00
34.95
A
(1)
Dimensions
Note
1. Total package thickness, exclusive punching burr.
PLLMC: plastic leadless module carrier package; 35 mm wide tape SOT500-4
D
For unspecified dimensions see PLLMC-drawing given in the subpackage code.
0 10 20 mm
scale
X
D
detail X
A
Figure 7. Package outline SOT500-4
For more details on the contactless MOA8 module see Ref. 7.
NXP Semiconductors
SL2S2002_SL2S2102
ICODE SLIX
SL2S2002_SL2S2102 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2017. All rights reserved.
Product data sheet Rev. 3.4 — 10 August 2017
COMPANY PUBLIC 178034 30 / 39
14 Bare die outline
(1) X-scribe line width: 15 μm
(2) Y-scribe line width: 15 μm
(3) Chip step, X-length: 535 μm
(4) Chip step, Y-length: 499 μm
(5) Bump to bump distance X (LA - LB): 400 μm
(6) Bump to bump distance Y (LB - TEST): 360 μm
(7) Distance bump to nitride edge X: 75 μm
(8) Distance bump to nitride edge Y: 45 μm
Bump size X × Y: 60 μm × 60 μm
Figure 8. Wafer SL2S2002FUDbare die layout
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P30P31-P33P34-P36P37-P39

SL2S2102FUD,003

Mfr. #:
Buy SL2S2102FUD,003
Manufacturer:
NXP Semiconductors
Description:
RFID Transponders ICODE SLIX
Lifecycle:
New from this manufacturer.
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