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SL2S2102FUD,003

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P30P31-P33P34-P36P37-P39
NXP Semiconductors
SL2S2002_SL2S2102
ICODE SLIX
SL2S2002_SL2S2102 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2017. All rights reserved.
Product data sheet Rev. 3.4 — 10 August 2017
COMPANY PUBLIC 178034 37 / 39
Tables
Tab. 1. Ordering information ..........................................4
Tab. 2. Pin description SOT1122 .................................. 6
Tab. 3. Pin description SOT500-4 (MOA8) ....................6
Tab. 4. Bonding pad description ....................................8
Tab. 5. Wafer specification ............................................9
Tab. 6. Memory organization .......................................11
Tab. 7. Unique identifier .............................................. 12
Tab. 8. Request format ................................................15
Tab. 9. Response format when Error_flag set ............. 15
Tab. 10. Response format when Error_flag NOT set .....15
Tab. 11. Request format ................................................16
Tab. 12. Password Identifier ..........................................16
Tab. 13. Response format when Error_flag set ............. 16
Tab. 14. Response format when Error_flag NOT set .....16
Tab. 15. Request format ................................................17
Tab. 16. Password identifier .......................................... 17
Tab. 17. Response format when Error_flag set ............. 17
Tab. 18. Response format when Error_flag NOT set .....17
Tab. 19. Request format ................................................18
Tab. 20. Password identifier .......................................... 18
Tab. 21. Response format when Error_flag set ............. 18
Tab. 22. Response format when Error_flag NOT set .....18
Tab. 23. Request format ................................................19
Tab. 24. Response format: Option flag logic 0 .............. 19
Tab. 25. Response format: Option flag logic 1 .............. 19
Tab. 26. Example: mask length = 30 ............................ 20
Tab. 27. Request format ................................................20
Tab. 28. Response format when Error_flag set ............. 20
Tab. 29. Response format when Error_flag NOT set .....20
Tab. 30. Request format ................................................21
Tab. 31. Response format when Error_flag set ............. 21
Tab. 32. Response format when Error_flag NOT set .....21
Tab. 33. Request format ................................................21
Tab. 34. Response format when Error_flag set ............. 22
Tab. 35. Response format when Error_flag NOT set .....22
Tab. 36. Request format ................................................22
Tab. 37. Response format ............................................. 22
Tab. 38. Request format ................................................23
Tab. 39. Response format when Error_flag set ............. 23
Tab. 40. Response format when Error_flag NOT set .....23
Tab. 41. Limiting values (Wafer)Stresses above
those listed under Absolute Maximum
Ratings may cause permanent damage to
the device. This is a stress rating only and
functional operation of the device at these
or any conditions other than those described
in the operating conditions and electrical
characteristics sections of this specification
is not implied.This product includes circuitry
specifically designed for the protection of its
internal devices from the damaging effects
of excessive static charge. Nonetheless, it
is suggested that conventional precautions
be taken to avoid applying greater than the
rated maxima. ................................................. 25
Tab. 42. EEPROM characteristics .................................26
Tab. 43. Interface characteristics .................................. 26
Tab. 44. Marking SOT1122 ........................................... 27
Tab. 45. Abbreviations ...................................................32
Tab. 46. Revision history ...............................................34
NXP Semiconductors
SL2S2002_SL2S2102
ICODE SLIX
SL2S2002_SL2S2102 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2017. All rights reserved.
Product data sheet Rev. 3.4 — 10 August 2017
COMPANY PUBLIC 178034 38 / 39
Figures
Fig. 1. Block diagram of ICODE SLIX .......................... 5
Fig. 2. Pin configuration for SOT1122 ..........................6
Fig. 3. Pin configuration for SOT500-4 (MOA8) ........... 6
Fig. 4. Wafer SL2S2002FUDlayout and pin
configuration for the bare die ............................ 7
Fig. 5. Wafer SL2S2102FUD layout and pin
configuration for the bare die ............................ 8
Fig. 6. Package outline SOT1122 .............................. 28
Fig. 7. Package outline SOT500-4 ............................. 29
Fig. 8. Wafer SL2S2002FUDbare die layout .............. 30
Fig. 9. Wafer SL2S2102FUD bare die layout ............. 31
NXP Semiconductors
SL2S2002_SL2S2102
ICODE SLIX
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section 'Legal information'.
© NXP B.V. 2017. All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 10 August 2017
Document identifier: SL2S2002_SL2S2102
Document number: 178034
Contents
1 General description ............................................ 1
1.1 Contactless energy and data transfer ................1
1.2 Anticollision ........................................................1
1.3 Security and privacy aspects .............................1
2 Features and benefits .........................................2
2.1 ICODE SLIX RF interface (ISO/IEC 15693) .......2
2.2 EEPROM ........................................................... 2
2.3 Security ..............................................................2
3 Applications .........................................................3
4 Ordering information .......................................... 4
5 Block diagram ..................................................... 5
6 Pinning information ............................................ 6
7 Wafer layout ........................................................ 7
7.1 Bonding pad description .................................... 8
8 Mechanical specification ....................................9
8.1 Wafer specification ............................................ 9
8.1.1 Fail die identification ........................................10
8.1.2 Map file distribution ......................................... 10
9 Functional description ......................................11
9.1 Block description ............................................. 11
9.2 Memory organization ....................................... 11
9.2.1 Unique identifier ...............................................12
9.2.2 Configuration of delivered ICs ......................... 12
9.3 Communication principle ................................. 13
9.4 Supported commands ......................................13
9.4.1 Mandatory commands ..................................... 13
9.4.1.1 INVENTORY .................................................... 13
9.4.1.2 STAY QUIET ................................................... 13
9.4.2 Optional commands .........................................13
9.4.2.1 READ SINGLE BLOCK ................................... 13
9.4.2.2 WRITE SINGLE BLOCK ..................................13
9.4.2.3 LOCK BLOCK ..................................................13
9.4.2.4 READ MULTIPLE BLOCKS .............................13
9.4.2.5 SELECT ........................................................... 14
9.4.2.6 RESET TO READY ......................................... 14
9.4.2.7 WRITE AFI ...................................................... 14
9.4.2.8 LOCK AFI ........................................................ 14
9.4.2.9 WRITE DSFID ................................................. 14
9.4.2.10 LOCK DSFID ................................................... 14
9.4.2.11 GET SYSTEM INFORMATION ....................... 14
9.4.2.12 GET MULTIPLE BLOCK SECURITY
STATUS ...........................................................15
9.4.3 Custom commands ..........................................15
9.4.3.1 GET RANDOM NUMBER ................................15
9.4.3.2 SET PASSWORD ............................................15
9.4.3.3 WRITE PASSWORD ....................................... 16
9.4.3.4 LOCK PASSWORD ......................................... 17
9.4.3.5 INVENTORY READ .........................................18
9.4.3.6 FAST INVENTORY READ ...............................20
9.4.3.7 SET EAS ......................................................... 20
9.4.3.8 RESET EAS .................................................... 21
9.4.3.9 LOCK EAS .......................................................21
9.4.3.10 EAS ALARM .................................................... 22
9.4.3.11 PASSWORD PROTECT EAS/AFI ................... 22
9.5 Error handling .................................................. 23
9.5.1 Transmission errors ......................................... 23
9.5.2 Not supported commands or options ...............23
9.5.2.1 Non Addressed Mode ......................................23
9.5.2.2 Addressed or Selected Mode .......................... 23
9.5.3 Parameter out of range ................................... 24
9.5.3.1 Read commands ............................................. 24
9.5.3.2 Write and lock commands ............................... 24
9.6 Data integrity ................................................... 24
9.7 RF interface ..................................................... 24
10 Limiting values ..................................................25
11 Characteristics .................................................. 26
11.1 Memory characteristics ....................................26
11.2 Interface characteristics ...................................26
12 Marking ...............................................................27
12.1 Marking SOT1122 ............................................27
13 Package outline .................................................28
14 Bare die outline .................................................30
15 Abbreviations .................................................... 32
16 References ......................................................... 33
17 Revision history ................................................ 34
18 Legal information .............................................. 35
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P30P31-P33P34-P36P37-P39

SL2S2102FUD,003

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Buy SL2S2102FUD,003
Manufacturer:
NXP Semiconductors
Description:
RFID Transponders ICODE SLIX
Lifecycle:
New from this manufacturer.
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