NXP Semiconductors
SL2S2002_SL2S2102
ICODE SLIX
SL2S2002_SL2S2102 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2017. All rights reserved.
Product data sheet Rev. 3.4 — 10 August 2017
COMPANY PUBLIC 178034 4 / 39
4 Ordering information
Table 1. Ordering information
PackageType number
Name Description
Version
SL2S2002FUD wafer sawn, bumped wafer, 120 μm, on film frame carrier,
C
i
between LA and LB = 23.5 pF (typical)
-
SL2S2102FUD wafer sawn, bumped wafer, 120 μm, on film frame carrier,
C
i
between LA and LB = 97 pF (typical)
-
SL2S2002FTB XSON3 plastic extremely thin small outline package; no leads;
3 terminals; body 1 x 1.45 x 0.5 mm;
C
i
between LA and LB = 23.5 pF (typical)
SOT1122
SL2S2102FTB XSON3 plastic extremely thin small outline package; no leads;
3 terminals; body 1 x 1.45 x 0.5 mm;
C
i
between LA and LB = 97 pF (typical)
SOT1122
SL2S2002FA8 MOA8 plastic lead less module carrier package;
35 mm wide tape;
C
i
between LA and LB = 23.5 pF (typical)
SOT500-4
