NXP Semiconductors
SL2S2002_SL2S2102
ICODE SLIX
SL2S2002_SL2S2102 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2017. All rights reserved.
Product data sheet Rev. 3.4 — 10 August 2017
COMPANY PUBLIC 178034 31 / 39
001aam545
not to scale!
(1)
(7)
(2)
(8)
(5)
(6) (4)
(3)
Y
X
GND
LA LB
TEST
(1) X-scribe line width: 15 μm
(2) Y-scribe line width: 15 μm
(3) Chip step, X-length: 535 μm
(4) Chip step, Y-length: 622 μm
(5) Bump to bump distance X (LA - LB): 400 μm
(6) Bump to bump distance Y (LB - TEST): 517 μm
(7) Distance bump to nitride edge X: 75 μm
(8) Distance bump to nitride edge Y: 45 μm
Bump size X × Y: 60 μm × 60 μm
Figure 9. Wafer SL2S2102FUD bare die layout
NXP Semiconductors
SL2S2002_SL2S2102
ICODE SLIX
SL2S2002_SL2S2102 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2017. All rights reserved.
Product data sheet Rev. 3.4 — 10 August 2017
COMPANY PUBLIC 178034 32 / 39
15 Abbreviations
Table 45. Abbreviations
Acronym Description
AFI Application Family Identifier
CRC Cyclic Redundancy Check
DSFID Data Storage Format Identifier
EAS Electronic Article Surveillance
EEPROM Electrically Erasable Programmable Read Only Memory
EOF End Of Frame
IC Integrated Circuit
LCR Inductance, Capacitance, Resistance
LSB Least Significant Byte/Bit
MSB Most Significant Byte/Bit
RF Radio Frequency
SOF Start Of Frame
UID Unique IDentifier
NXP Semiconductors
SL2S2002_SL2S2102
ICODE SLIX
SL2S2002_SL2S2102 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2017. All rights reserved.
Product data sheet Rev. 3.4 — 10 August 2017
COMPANY PUBLIC 178034 33 / 39
16 References
[1]
ISO Standard
ISO/IEC 15693 - Identification cards - Contactless integrated circuit cards - Vicinity cards.
[2]
ISO Standard
ISO/IEC 15693-2 -Identification cards - Contactless integrated circuit cards - Vicinity
cards - Part 2: Air interface and initialization.
[3]
ISO Standard
ISO/IEC 15693-3 -Identification cards - Contactless integrated circuit cards - Vicinity
cards - Part 3: Anticollision and transmission protocol.
[4]
ISO Standard
ISO/IEC 18000-3 - Information technology - Radio frequency identification for item
management - Part 3: Parameters for air interface communications at 13.56 MHz.
[5]
ISO Standard
ISO/IEC 7816-6 - Identification cards - Integrated circuit cards - Part 6: Interindustry data
elements for interchange.
[6]
General specification for 8" wafer on UV-tape with electronic fail die marking
Delivery type description – BL-ID document number: 1093**
1
.
[7]
Contactless smart card module specification MOA8
Delivery Type Description, BU-ID Document number 1636**1.
1 ** ... document version number

SL2S2102FUD,003

Mfr. #:
Manufacturer:
NXP Semiconductors
Description:
RFID Transponders ICODE SLIX
Lifecycle:
New from this manufacturer.
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