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SC68C752BIBS,151

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P30P31-P33P34-P36P37-P39P40-P42P43-P45P46-P48
SC68C752B_4 © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 04 — 20 January 2010 40 of 48
NXP Semiconductors
SC68C752B
5 V, 3.3 V and 2.5 V dual UART, 5 Mbit/s (max.), with 64-byte FIFOs
Fig 22. Transmit ready timing in non-FIFO mode
D0 D1 D2 D3 D4 D5 D6 D7
002aab09
4
Start
bit
t
d17
TXA,
TXB
TXRDYA,
TXRDYB
CS (write)
data bits (0 to 7)
active
D0 to D7 byte #1
t
d18
transmitter
not ready
active
transmitter ready
parity
bit
Stop
bit
next
data
Start
bit
Fig 23. Transmit ready timing in FIFO mode
D0 D1 D2 D3 D4 D5 D6 D7
002aab37
7
stop
bit
parity
bit
t
d17
TXA,
TXB
CS (write)
D0 to D7
start
bit
data bits (0 to 7)
byte #64
TXRDYA,
TXRDYB
t
d18
trigger
lead
active
5 data bits
6 data bits
7 data bits
SC68C752B_4 © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 04 — 20 January 2010 41 of 48
NXP Semiconductors
SC68C752B
5 V, 3.3 V and 2.5 V dual UART, 5 Mbit/s (max.), with 64-byte FIFOs
12. Package outline
Fig 24. Package outline SOT313-2 (LQFP48)
UNIT
A
max.
A
1
A
2
A
3
b
p
cE
(1)
eH
E
LL
p
Zywv θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
mm
1.6
0.20
0.05
1.45
1.35
0.25
0.27
0.17
0.18
0.12
7.1
6.9
0.5
9.15
8.85
0.95
0.55
7
0
o
o
0.12 0.10.21
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
0.75
0.45
SOT313-2 MS-026136E05
00-01-19
03-02-25
D
(1) (1)(1)
7.1
6.9
H
D
9.15
8.85
E
Z
0.95
0.55
D
b
p
e
E
B
12
D
H
b
p
E
H
v M
B
D
Z
D
A
Z
E
e
v M
A
1
48
37
36
25
24
13
θ
A
1
A
L
p
detail X
L
(A )
3
A
2
X
y
c
w M
w M
0 2.5 5 mm
scale
pin 1 index
L
QFP48: plastic low profile quad flat package; 48 leads; body 7 x 7 x 1.4 mm
SOT313
-2
SC68C752B_4 © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 04 — 20 January 2010 42 of 48
NXP Semiconductors
SC68C752B
5 V, 3.3 V and 2.5 V dual UART, 5 Mbit/s (max.), with 64-byte FIFOs
Fig 25. Package outline SOT617-1 (HVQFN32)
0.51
A
1
E
h
b
UNIT
ye
0.2
c
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
mm
5.1
4.9
D
h
3.25
2.95
y
1
5.1
4.9
3.25
2.95
e
1
3.5
e
2
3.5
0.30
0.18
0.05
0.00
0.05 0.1
DIMENSIONS (mm are the original dimensions)
SOT617-1 MO-220- - - - - -
0.5
0.3
L
0.1
v
0.05
w
0 2.5 5 mm
scale
SOT617
-1
H
VQFN32: plastic thermal enhanced very thin quad flat package; no leads;
3
2 terminals; body 5 x 5 x 0.85 mm
A
(1)
max.
A
A
1
c
detail X
y
y
1
C
e
L
E
h
D
h
e
e
1
b
916
32
25
24
17
8
1
X
D
E
C
B
A
e
2
terminal 1
index area
terminal 1
index area
01-08-08
02-10-18
1/2 e
1/2 e
AC
C
B
v
M
w
M
E
(1)
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
D
(1)
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P30P31-P33P34-P36P37-P39P40-P42P43-P45P46-P48

SC68C752BIBS,151

Mfr. #:
Buy SC68C752BIBS,151
Manufacturer:
NXP Semiconductors
Description:
IC UART DUAL W/FIFO 32-HVQFN
Lifecycle:
New from this manufacturer.
Delivery:
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