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TDA8954J/N1,112

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P30P31-P33P34-P36P37-P39P40-P42P43-P45P46-P46
TDA8954_1 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 01 — 24 December 2009 37 of 46
NXP Semiconductors
TDA8954
2 × 210 W class-D power amplifier
V
DD
= 39 V, V
SS
= −39 V, f
osc
= 325 kHz (external 650 kHz oscillator), 2 × 3 Ω SE configuration.
Heat sink: Fisher SK495/50; Sil-Pad: 1500ST. Condition: 30 minutes pre-heated in Mute
(1) Maximum output power; TFB on.
(2) Maximum output power / 8; TFB on.
(3) Maximum output power; TFB off.
(4) Maximum output power / 8; TFB off.
Fig 32. Output power as a function of time, 2 × 3 Ω
V
DD
= 41 V, V
SS
= −41 V, f
osc
= 325 kHz (external 650 kHz oscillator), 2 × 4 Ω SE configuration
Heat sink: Fisher SK495/50; Sil-Pad: 1500ST. Condition: 30 minutes pre-heated in Mute
(1) Maximum output power; TFB on.
(2) Maximum output power / 8; TFB on.
(3) Maximum output power; TFB off.
(4) Maximum output power / 8; TFB off.
Fig 33. Output power as a function of time, 2 × 4 Ω
OTP activated
T (sec)
0 600400200100 500300
010aaa630
100
200
300
Po
(W)
0
(1)
(4)
(2)
(3)
(1)
(3)
(4)
(2)
T (sec)
0 600400200100 500300
010aaa631
100
150
50
200
250
Po
(W)
0
TDA8954_1 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 01 — 24 December 2009 38 of 46
NXP Semiconductors
TDA8954
2 × 210 W class-D power amplifier
15. Package outline
Fig 34. Package outline SOT411-1 (DBS23P)
UNIT A
2
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
mm
4.6
4.3
A
4
1.15
0.85
A
5
1.65
1.35
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
SOT411-1
98-02-20
02-04-24
0 5 10 mm
scale
D
L
L
1
L
2
E
2
E
c
A
4
A
5
A
2
m
L
3
E
1
Q
w M
b
p
1
d
Z
e
2
e
e
123
j
D
BS23P: plastic DIL-bent-SIL power package; 23 leads (straight lead length 3.2 mm)
SOT411
-1
v M
D
x
h
E
h
non-concave
view B: mounting base side
B
β
e
1
b
p
cD
(1)
E
(1)
Z
(1)
deD
h
LL
3
m
0.75
0.60
0.55
0.35
30.4
29.9
28.0
27.5
12 2.54
12.2
11.8
10.15
9.85
1.27
e
2
5.08
2.4
1.6
E
h
6
E
1
14
13
L
1
10.7
9.9
L
2
6.2
5.8
E
2
1.43
0.78
2.1
1.8
1.85
1.65
4.3
3.6
2.8
Qj
0.25
w
0.6
v
0.03
x
45°
β
TDA8954_1 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 01 — 24 December 2009 39 of 46
NXP Semiconductors
TDA8954
2 × 210 W class-D power amplifier
Fig 35. Package outline SOT566-3 (HSOP24)
UNIT
A
4
(1)
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
03-02-18
03-07-23
IEC JEDEC JEITA
mm
+0.08
−0.04
3.5 0.35
DIMENSIONS (mm are the original dimensions)
Notes
1. Limits per individual lead.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
SOT566-3
0 5 10 mm
scale
H
SOP24: plastic, heatsink small outline package; 24 leads; low stand-off height
SOT566-
3
A
max.
detail X
A
2
3.5
3.2
D
2
1.1
0.9
H
E
14.5
13.9
L
p
1.1
0.8
Q
1.7
1.5
2.7
2.2
v
0.25
w
0.25
yZ
8°
0°
θ
0.07
x
0.03
D
1
13.0
12.6
E
1
6.2
5.8
E
2
2.9
2.5
b
p
c
0.32
0.23
e
1
D
(2)
16.0
15.8
E
(2)
11.1
10.9
0.53
0.40
A
3
A
4
A
2
(A
3
)
L
p
θ
A
Q
D
y
x
H
E
E
c
v M
A
X
A
b
p
w M
Z
D
1
D
2
E
2
E
1
e
24
13
1
12
pin 1 index
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P30P31-P33P34-P36P37-P39P40-P42P43-P45P46-P46

TDA8954J/N1,112

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Buy TDA8954J/N1,112
Manufacturer:
NXP Semiconductors
Description:
Audio Amplifiers 2-CH 210 W class-D power amplifier
Lifecycle:
New from this manufacturer.
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