TDA8007BHL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 9.1 — 18 June 2012 35 of 51
NXP Semiconductors
TDA8007BHL
Multiprotocol IC card interface
9. Limiting values
[1] Human body model as define in JEDEC Standard JESD22-A114-B dated June 2000
10. Thermal characteristics
11. Characteristics
Table 33. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
V
DD
supply voltage 0.5 +6.5 V
V
DDA
analog supply voltage 0.5 +6.5 V
V
I
input voltage on pins SAM, SAP, SBM, SBP and V
UP
0.5 +7.5 V
on all other pins 0.5 V
DD
+0.5 V
P
tot
total power dissipation T
amb
= - 25 to +85 °C - 700 mW
T
stg
storage temperature 55 +150 °C
T
j
junction temperature - 125 °C
V
esd
electrostatic discharge voltage human body model
[1]
on pins I/O1, I/O2, V
CC1
, V
CC2
, RST1,
RST2, CLK1, CLK2, CGND1, CGND2,
PRES1 and PRES2
6+6 kV
on pins C4x, C8x 5+5 kV
on all other pins 2+2 kV
Table 34. Thermal characteristics
Symbol Package name Parameter Conditions Typ Unit
R
th(j-a)
LQFP48 thermal resistance from junction to
ambient
in free air 78 K/W
Table 35. Characteristics
V
DD
=3.3V; V
DDA
=3.3V; T
amb
= 25 °C; unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
Supplies
V
DD
supply voltage 2.7 - 6.0 V
V
DDA
analog
supply voltage
step-up converter V
DD
-6.0 V
I
DD(pd)
supply current in power-down mode cards inactive; f
XTAL
=0Hz - - 350 A
cards active; V
CC
=5V;
f
CLK
=0Hz; f
XTAL
=0Hz
--3 mA
I
DD(sm)
supply current in sleep mode cards active; f
CLK
=0Hz - - 5.5 mA