2000 Jan 04 2
Philips Semiconductors Product specification
Stand-alone CAN controller SJA1000
CONTENTS
1 FEATURES
2 GENERAL DESCRIPTION
3 ORDERING INFORMATION
4 BLOCK DIAGRAM
5 PINNING
6 FUNCTIONAL DESCRIPTION
6.1 Description of the CAN controller blocks
6.1.1 Interface Management Logic (IML)
6.1.2 Transmit Buffer (TXB)
6.1.3 Receive Buffer (RXB, RXFIFO)
6.1.4 Acceptance Filter (ACF)
6.1.5 Bit Stream Processor (BSP)
6.1.6 Bit Timing Logic (BTL)
6.1.7 Error Management Logic (EML)
6.2 Detailed description of the CAN controller
6.2.1 PCA82C200 compatibility
6.2.2 Differences between BasicCAN and PeliCAN
mode
6.3 BasicCAN mode
6.3.1 BasicCAN address layout
6.3.2 Reset values
6.3.3 Control Register (CR)
6.3.4 Command Register (CMR)
6.3.5 Status Register (SR)
6.3.6 Interrupt Register (IR)
6.3.7 Transmit buffer layout
6.3.8 Receive buffer
6.3.9 Acceptance filter
6.4 PeliCAN mode
6.4.1 PeliCAN address layout
6.4.2 Reset values
6.4.3 Mode Register (MOD)
6.4.4 Command Register (CMR)
6.4.5 Status Register (SR)
6.4.6 Interrupt Register (IR)
6.4.7 Interrupt Enable Register (IER)
6.4.8 Arbitration Lost Capture register (ALC)
6.4.9 Error Code Capture register (ECC)
6.4.10 Error Warning Limit Register (EWLR)
6.4.11 RX Error Counter Register (RXERR)
6.4.12 TX Error Counter Register (TXERR)
6.4.13 Transmit buffer
6.4.14 Receive buffer
6.4.15 Acceptance filter
6.4.16 RX Message Counter (RMC)
6.4.17 RX Buffer Start Address register (RBSA)
6.5 Common registers
6.5.1 Bus Timing Register 0 (BTR0)
6.5.2 Bus Timing Register 1 (BTR1)
6.5.3 Output Control Register (OCR)
6.5.4 Clock Divider Register (CDR)
7 LIMITING VALUES
8 THERMAL CHARACTERISTICS
9 DC CHARACTERISTICS
10 AC CHARACTERISTICS
10.1 AC timing diagrams
10.2 Additional AC information
11 PACKAGE OUTLINES
12 SOLDERING
12.1 Introduction
12.2 DIP
12.2.1 Soldering by dipping or by wave
12.2.2 Repairing soldered joints
12.3 SO
12.3.1 Reflow soldering
12.3.2 Wave soldering
12.3.3 Repairing soldered joints
13 DEFINITIONS
14 LIFE SUPPORT APPLICATIONS
