DS002 (v1.5) December 5, 2001
www.xilinx.com
1
Preliminary Product Specification
1-800-255-7778
© 2001 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at
http://www.xilinx.com/legal.htm
.
All other trademarks and registered trademarks are the property of their respective owners. All specifications are subject to change without notice.
7
Features
Certified to MIL-PRF-38535 (Qualified Manufacturer
Listing)
Guaranteed over the full military temperature range
(–55
°
C to +125
°
C)
Ceramic and Plastic Packages
Fast, high-density Field-Programmable Gate Arrays
- Densities from 100K to 1M system gates
- System performance up to 200 MHz
- Hot-swappable for Compact PCI
Multi-standard SelectI/O™ interfaces
- 16 high-performance interface standards
- Connects directly to ZBTRAM devices
Built-in clock-management circuitry
- Four dedicated delay-locked loops (DLLs) for
advanced clock control
- Four primary low-skew global clock distribution
nets, plus 24 secondary global nets
Hierarchical memory system
- LUTs configurable as 16-bit RAM, 32-bit RAM,
16-bit dual-ported RAM, or 16-bit Shift Register
- Configurable synchronous dual-ported 4K-bit
RAMs
- Fast interfaces to external high-performance RAMs
Flexible architecture that balances speed and density
- Dedicated carry logic for high-speed arithmetic
- Dedicated multiplier support
- Cascade chain for wide-input functions
- Abundant registers/latches with clock enable, and
dual synchronous/asynchronous set and reset
- Internal 3-state bussing
- IEEE 1149.1 boundary-scan logic
- Die-temperature sensing device
Supported by FPGA Foundation™ and Alliance
Development Systems
- Complete support for Unified Libraries, Relationally
Placed Macros, and Design Manager
- Wide selection of PC and workstation platforms
SRAM-based in-system configuration
- Unlimited reprogrammability
- Four programming modes
•0.22
µ
m 5-layer metal process
100% factory tested
Available to Standard Microcircuit Drawings
- 5962-99572 for XQV300
- 5962-99573 for XQV600
- 5962-99574 for XQV1000
- Contact Defense Supply Center Columbus (DSCC)
for more information at
http://www.dscc.dla.mil
Description
The QPro™ Virtex™ FPGA family delivers high-perfor-
mance, high-capacity programmable logic solutions. Dra-
matic increases in silicon efficiency result from optimizing
the new architecture for place-and-route efficiency and
exploiting an aggressive 5-layer-metal 0.22
µ
m CMOS pro-
cess. These advances make QPro Virtex FPGAs powerful
and flexible alternatives to mask-programmed gate arrays.
The Virtex family comprises the four members shown in
Ta b l e 1 .
Building on experience gained from previous generations of
FPGAs, the Virtex family represents a revolutionary step
forward in programmable logic design. Combining a wide
variety of programmable system features, a rich hierarchy of
fast, flexible interconnect resources, and advanced process
technology, the QPro Virtex family delivers a high-speed
and high-capacity programmable logic solution that
enhances design flexibility while reducing time-to-market.
Refer to the “Virtex™ 2.5V Field Programmable Gate
Arrays commercial data sheet for more information on
device architecture and timing specifications.
0
QPro
Virtex 2.5V QML
High-Reliability FPGAs
DS002 (v1.5) December 5, 2001
02
Preliminary Product Specification
R
QPro Virtex 2.5V QML High-Reliability FPGAs
2
www.xilinx.com
DS002 (v1.5) December 5, 2001
1-800-255-7778
Preliminary Product Specification
R
Virtex Electrical Characteristics
Based on preliminary characterization. Further changes are not expected.
All specifications are representative of worst-case supply voltage and junction temperature conditions. The parameters
included are common to popular designs and typical applications. Contact the factory for design considerations requiring
more detailed information.
Virtex DC Characteristics
Absolute Maximum Ratings
Table 1:
QPro Virtex Field-Programmable Gate Array Family Members
Device System Gates CLB Array Logic Cells
Maximum
Available I/O Block RAM Bits
Max Select
RAM Bits
XQV100 108,904 20 x 30 2,700 180 40,960 38,400
XQV300 322,970 32 x 48 6,912 316 65,536 98,304
XQV600 661,111 48 x 72 15,552 316 98,304 221,184
XQV1000 1,124,022 64 x 96 27,648 404 131,072 393,216
Symbol Description Min/Max Units
V
CCINT
Supply voltage relative to GND 0.5 to 3.0 V
V
CCO
Supply voltage relative to GND 0.5 to 4.0 V
V
REF
Input reference Voltage 0.5 to 3.6 V
V
IN
(3)
Input voltage relative to GND Using V
REF
0.5 to 3.6 V
Internal threshold 0.5 to 5.5 V
V
TS
Voltage applied to 3-state output 0.5 to 5.5 V
V
CC
Longest supply voltage rise time from 1V to 2.375V 50 ms
T
STG
Storage temperature (ambient) 65 to +150
°
C
T
J
Junction temperature Ceramic packages +150
°
C
Plastic packages +125
°
C
Notes:
1. Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress
ratings only, and functional operation of the device at these or any other conditions beyond those listed under Operating Conditions
is not implied. Exposure to Absolute Maximum Ratings conditions for extended periods of time may affect device reliability.
2. Power supplies may turn on in any order.
3. For protracted periods (e.g., longer than a day), V
IN
should not exceed V
CCO
by more that 3.6V.
QPro Virtex 2.5V QML High-Reliability FPGAs
DS002 (v1.5) December 5, 2001
www.xilinx.com
3
Preliminary Product Specification
1-800-255-7778
R
Recommended Operating Conditions
DC Characteristics Over Recommended Operating Conditions
Symbol Description Min Max Units
V
CCINT
Supply voltage relative to GND, T
C
= 55
°
C to +125
°
C Ceramic packages 2.5 5% 2.5 + 5% V
Supply voltage relative to GND, T
J
= 55
°
C to +125
°
C Plastic packages 2.5 5% 2.5 + 5% V
V
CCO
Supply voltage relative to GND, T
C
= 55
°
C to +125
°
C Ceramic packages 1.2 3.6 V
Supply voltage relative to GND, T
J
= 55
°
C to +125
°
C Plastic packages 1.2 3.6 V
T
IN
Input signal transition time - 250 ns
T
IC
Initialization Temperature Range
(4)
XQVR300 55 +125
°
C
XQVR600 55 +125
°
C
XQVR1000 40 +125
°
C
T
OC
Operational Temperature Range
(5)
XQVR300 55 +125
°
C
XQVR600 55 +125
°
C
XQVR1000 55 +125
°
C
Notes:
1. Correct operation is guaranteed with a minimum V
CCINT
of 2.25V (Nominal V
CCINT
10%). Below the minimum value stated above,
all delay parameters increase by 3% for each 50 mV reduction in V
CCINT
below the specified range.
2. At junction temperatures above those listed as Operating Conditions, all delay parameters increase by 0.35% per
°
C.
3. Input and output measurement threshold is ~50% of V
CC
.
4. Initialization occurs from the moment of V
CC
ramp-up to the rising transition of the INIT pin.
5. The device is operational after the INIT pin has transitioned high.
Symbol Description Device Min Max Units
V
DRINT
Data retention V
CCINT
voltage
(below which configuration data may be lost)
All 2.0 - V
V
DRIO
Data retention V
CCO
voltage
(below which configuration data may be lost)
All 1.2 - V
I
CCINTQ
Quiescent V
CCINT
supply current
(1)
XQV100 - 50 mA
XQV300 - 75 mA
XQV600 - 100 mA
XQV1000 - 100 mA
I
CCOQ
Quiescent V
CCINT
supply current
(1)
XQV100 - 2 mA
XQV300 - 2 mA
XQV600 - 2 mA
XQV1000 - 2 mA
I
REF
V
REF
current per V
REF
pin - - 20
µ
A
I
L
Input or output leakage current - 10 +10
µ
A
C
IN
Input capacitance (sample tested) - - 8 pF
I
RPU
Pad pull-up (when selected) at V
IN
= 0V, V
CCO
= 3.3V (sample tested) -
(2)
0.25 mA
I
RPD
Pad pull-down (when selected) at V
IN
= 3.6V (sample tested) -
(2)
0.15 mA
Notes:
1. With no output current loads, no active input pull-up resistors, all I/O pins in a High-Z state and floating.
2. Internal pull-up and pull-down resistors guarantee valid logic levels at unconnected input pins. These pull-up and pull-down resistors
do not guarantee valid logic levels when input pins are connected to other circuits.

5962-9957201NNA

Mfr. #:
Manufacturer:
Xilinx
Description:
IC FPGA 2.5V HIREL VIRTEX 300
Lifecycle:
New from this manufacturer.
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