QPro Virtex 2.5V QML High-Reliability FPGAs
DS002 (v1.5) December 5, 2001
www.xilinx.com
31
Preliminary Product Specification
1-800-255-7778
R
SMD (Class Q) Odering Options
Revision History
The following table shows the revision history for this document
Date Version Revision
10/04/99 1.0 Initial Xilinx release.
06/01/00 1.1 Upated format.
02/13/01 1.2 Updated Temperature Specifications.
11/05/01 1.3 Changed V600 Power-up temp min to –55°C. Added L33 as Bank 7 V
REF
. Updated format.
11/15/01 1.4 Fixed boken links. Added note for VCCO banking rules for PQ240 package.
12/05/01 1.5 Corrected Table 5 pin description for pin 9 and pin 39.
5962 9957201 Q Y C
Lead Finish
Generic Standard
Microcircuit Drawing (SMD)
Device Type
Package Type
QML Certified MIL-PRF-38535
(1)
Valid SMD Combinations
SMD Number Device Pkg Markings Lead Finish
5962-9957201QYC
XQV300-4CB228Q Lid Gold Plate
5962-9957201QZC
XQV300-4CB228Q Base Gold Plate
5962-9957201NTB
XQV300-4PQ240N -
Solder Plate
5962-9957201NNA
XQV300-4BG352N
-
Solder Ball
5962-9957201NUA
XQV300-4BG432N
-
Solder Ball
5962-9957301QYC
XQV600-4CB228Q Lid Gold Plate
5962-9957301QZC
XQV600-4CB228Q Base Gold Plate
5962-9957301NTB
XQV600-4HQ240N
-
Solder Plate
5962-9957301NUA
XQV600-4BG432N
-
Solder Ball
5962-9957401QXC
XQV1000-4CG560Q - Solder Column
5962-9957401NUA
XQV1000-4BG560N
-
Solder Ball
Notes:
1. Type N designates QML Plastic.
