QPro Virtex 2.5V QML High-Reliability FPGAs
30
www.xilinx.com
DS002 (v1.5) December 5, 2001
1-800-255-7778
Preliminary Product Specification
R
Device/Package Combinations and Maximum I/O
Ordering Information
Package
Maximum User I/O (Excluding dedicated clock pins.)
XQV100 XQV300 XQV600 XQV1000
PQ240 166 166 - -
HQ240 - - 166 -
BG256 180 - - -
BG352----
BG432 - 316 316 -
BG560 - - - 404
CB228 162 162 162 -
CG560 - - - 404
XQV300 -4 CB 228 M
Example:
Temperature Range/Grade
Number of Pins
Package Type
Device Type
Speed Grade
(1)
Device Ordering Options
Device Type Package Grade
Temperature
XQV100 PQ240 240-pin Plastic Quad Flat Package
M
Military Ceramic T
C
=
–
55°C to +125°C
XQV300 HQ240 240-pin High Heat Dissipation QFP Package
N
Military Plastic T
J
=
–
55°C to +125°C
XQV600 BG256 256-ball Plastic BGA Package Q MIL-PRF-38535
(2)
T
C
=
–
55°C to +125°C
XQV1000 BG352 352-ball Plastic BGA Package
BG432 432-ball Plastic BGA Package
BG560 560-ball Plastic BGA Package
CB228 228-pin Ceramic Quad Flat Package
CG560 560-column Ceramic Column Grid Package
Notes:
1. -4 only supported speed grade.
2. Class Q must be ordered with SMD number.
Valid Ordering Combinations
M Grade N Grade
XQV100-4CB228M XQV100-4PQ240N XQV300-4BG432N
XQV300-4CB228M XQV100-4BG256N XQV600-4HQ240N
XQV600-4CB228M XQV300-4PQ240N XQV600-4BG432N
XQV1000-4CG560M XQV300-4BG352N XQV1000-4BG560N
