PCA85233 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet Rev. 4 — 6 May 2015 43 of 54
NXP Semiconductors
PCA85233
Automotive 80 × 4 LCD driver for low multiplex rates
[1] For most applications SDA and SDAACK are shorted together; see Section 8.
[2] The dummy pads are connected to V
SS
but are not tested.
[1] Pressure of diamond head: 10 g to 50 g.
BP3 109 1228.05 436.5 LCD backplane output
BP1 110 1174.05 436.5
D1 - 1932.03 436.5
[2]
dummy pad
D2 - 1909.53 436.5
D3 - 1801.53 436.5
D4 - 1693.53 436.5
D5 - 1585.53 436.5
D6 - 1477.53 436.5
D7 - 1846.35 436.5
D8 - 1953 436.5
D9 - 1930.05 436.5
Table 25. Gold bump hardness
Type number Min Max Unit
[1]
PCA85233UG/2DA/Q1 60 120 HV
The approximate positions of the alignment marks are shown in Figure 27.
Fig 28. Alignment marks of PCA85233
Table 26. Alignment mark locations
All x/y coordinates represent the position of the REF point (see Figure 28
) with respect to the center
(x/y = 0) of the chip; see Figure 27.
Symbol Size (m) X (m) Y (m)
S1 81 81 1916.1 45
C1 81 81 1855.8 45
Table 24. Bump locations of PCA85233UG
All x/y coordinates represent the position of the center of each bump with respect to the center
(x/y = 0) of the chip; see Figure 27
.
Symbol Bump X (m) Y (m) Description
