RECOMMENDED LAND PATTERN
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
Microchip Technology Drawing C04-2206%
10-Lead Very Thin Plastic Dual Flat, No Lead Package (9Q) - 3x3 mm Body [VDFN]
SILK SCREEN
1
2
C
G1
Y1
Y2
(G2)
X1
10
Dimension Limits
Units
CH
Optional Center Pad Width
Center Pad Chamfer
Optional Center Pad Length
Contact Pitch
X2
Y2
2.40
1.70
MILLIMETERS
0.50 BSC
MIN
E
MAX
0.28
Contact Pad Length (X10)
Contact Pad Width (X10)
Y1
X1
0.80
0.30
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Notes:
1.
NOM
CContact Pad Spacing 3.00
Contact Pad to Contact Pad (X8) G1 0.20
Contact Pad to Center Pad (X10) G2 0.25 REF
REF: Reference Dimension, usually without tolerances, for reference only.
Thermal Via Diameter V
Thermal Via Pitch VX
Thermal Via Pitch VY
0.30
1.00
1.00
2X CH
VY
VX
ØV
X2
For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during
reflow process
2.
Dimensioning and tolerancing per ASME Y14.5M
E
