LPC2917_19_1 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 01 — 31 July 2008 52 of 67
NXP Semiconductors
LPC2917/19
ARM9 microcontroller with CAN and LIN
[1] Based on package heat transfer, not device power consumption.
[2] Peak current must be limited at 25 times average current.
[3] For I/O Port 0, the maximum input voltage is defined by V
I(ADC)
.
[4] Only when V
DD(IO)
is present.
[5] Note that pull-up should be off. With pull-up do not exceed 3.6 V.
[6] In accordance with IEC 60747-1. An alternative definition of the virtual junction temperature is: T
vj
=T
amb
+P
tot
× R
th(j-a)
where R
th(j-a)
is
a fixed value; see Section 10. The rating for T
vj
limits the allowable combinations of power dissipation and ambient temperature.
[7] Human-body model: discharging a 100 pF capacitor via a 10 k series resistor.
[8] Machine model: discharging a 200 pF capacitor via a 0.75 µH series inductance and 10 resistor.
[9] 112 mA per V
DD(IO)
or V
SS(IO)
should not be exceeded.
10. Thermal characteristics
ESD
V
esd
electrostatic discharge
voltage
on all pins
human body model
[7]
2000 +2000 V
machine model
[8]
200 +200 V
charged device model 500 +500 V
on corner pins
charged device model 750 +750 V
Table 28. Limiting values
…continued
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
Table 29. Thermal characteristics
Symbol Parameter Conditions Value Unit
R
th(j-a)
thermal resistance from
junction to ambient
in free air
package;
LQFP144 62 K/W
LPC2917_19_1 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 01 — 31 July 2008 53 of 67
NXP Semiconductors
LPC2917/19
ARM9 microcontroller with CAN and LIN
11. Static characteristics
Table 30. Static characteristics
V
DD(CORE)
=V
DD(OSC_PLL)
; V
DD(IO)
= 2.7 V to 3.6 V; V
DDA(ADC3V3)
= 3.0 V to 3.6 V; T
vj
= -40
°
C to +125
°
C; all voltages are
measured with respect to ground; positive currents flow into the IC; unless otherwise specified.
[1]
Symbol Parameter Conditions Min Typ Max Unit
Supplies
Core supply
V
DD(CORE)
core supply voltage 1.71 1.80 1.89 V
I
DD(CORE)
core supply current ARM9 and all
peripherals active at
max clock speeds
- 1.1 2.5 mA/
MHz
all clocks off
[2]
- 30 450 µA
I/O supply
V
DD(IO)
I/O supply voltage 2.7 - 3.6 V
Oscillator supply
V
DD(OSC_PLL)
oscillator and PLL supply
voltage
1.71 1.80 1.89 V
I
DD(OSC_PLL)
oscillator and PLL supply
current
start-up 3 - 4.5 mA
normal mode - - 1 mA
Power-down mode - - 2 µA
Analog-to-digital converter supply
V
DDA(ADC3V3)
3.3 V ADC analog supply
voltage
3.0 3.3 3.6 V
I
DDA(ADC3V3)
3.3 V ADC analog supply
current
normal mode - - 1.9 mA
Power-down mode - - 4 µA
Input pins and I/O pins configured as input
V
I
input voltage all port pins and V
DD(IO)
applied except port 0
pins 16 to 31
see
Section 9
[7][8]
0.5 - + 5.5 V
port 0 pins 16 to 31
[8]
V
VREFP
all port pins and V
DD(IO)
not applied
0.5 - +3.6 V
all other I/O pins,
RESET_N, TRST_N,
TDI, JTAGSEL, TMS,
TCK
0.5 - V
DD(IO)
V
V
IH
HIGH-level input voltage all port pins, RESET_N,
TRST_N, TDI,
JTAGSEL, TMS, TCK
2.0 - - V
V
IL
LOW-level input voltage all port pins, RESET_N,
TRST_N, TDI,
JTAGSEL, TMS, TCK
- - 0.8 V
V
hys
hysteresis voltage 0.4 - - V
I
LIH
HIGH-level input leakage
current
--1µA
LPC2917_19_1 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 01 — 31 July 2008 54 of 67
NXP Semiconductors
LPC2917/19
ARM9 microcontroller with CAN and LIN
I
LIL
LOW-level input leakage
current
--1µA
I
I(pd)
pull-down input current all port pins, V
I
= 3.3 V;
V
I
= 5.5 V
25 50 100 µA
I
I(pu)
pull-up input current all port pins, RESET_N,
TRST_N, TDI,
JTAGSEL, TMS:
V
I
=0V;V
I
> 3.6 V is not
allowed
25 50 100 µA
C
i
input capacitance
[3]
-38pF
Output pins and I/O pins configured as output
V
O
output voltage 0 - V
DD(IO)
V
V
OH
HIGH-level output voltage I
OH
= 4mA V
DD(IO)
– 0.4 - - V
V
OL
LOW-level output voltage I
OL
= 4 mA - - 0.4 V
C
L
load capacitance - - 25 pF
Analog-to-digital converter supply
V
VREFN
voltage on pin VREFN 0 - V
VREFP
2V
V
VREFP
voltage on pin VREFP V
VREFN
+2 - V
DDA(ADC3V3)
V
V
I(ADC)
ADC input voltage on port 0 pins V
VREFN
-V
VREFP
V
Z
i
input impedance between V
VREFN
and
V
VREFP
4.4 - - k
FSR full scale range 2 - 10 bit
INL integral non-linearity 2 - +2 LSB
DNL differential non-linearity 1 - +1 LSB
V
err(offset)
offset error voltage 20 - +20 mV
V
err(FS)
full-scale error voltage 20 - +20 mV
Oscillator
R
s(xtal)
crystal series resistance f
osc
= 10 MHz to 15 MHz
[5]
C
xtal
=10pF;
C
ext
=18pF
- - 160
C
xtal
=20pF;
C
ext
=39pF
--60
f
osc
= 15 MHz to 20 MHz
[5]
C
xtal
=10pF;
C
ext
=18pF
--80
C
i
input capacitance of XIN_OSC
[9]
-2pF
Table 30. Static characteristics
…continued
V
DD(CORE)
=V
DD(OSC_PLL)
; V
DD(IO)
= 2.7 V to 3.6 V; V
DDA(ADC3V3)
= 3.0 V to 3.6 V; T
vj
= -40
°
C to +125
°
C; all voltages are
measured with respect to ground; positive currents flow into the IC; unless otherwise specified.
[1]
Symbol Parameter Conditions Min Typ Max Unit

LPC2919FBD144/01/,

Mfr. #:
Manufacturer:
NXP Semiconductors
Description:
ARM Microcontrollers - MCU ARM968 768K FL/48K
Lifecycle:
New from this manufacturer.
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