BGW200EG_1 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 01 — 18 July 2007 73 of 76
NXP Semiconductors
BGW200EG
IEEE 802.11b System-in-Package
20. Revision history
TXOP Transmission Opportunity
UART Universal Asynchronous Receiver Transmitter
VCO Voltage-Controlled Oscillator
VoIP Voice over Internet Protocol
VPB VLSI Peripheral Bus
WDT WatchDog Timer
WEP Wired Equivalent Privacy
WinCE Windows Compact Edition
WLAN Wireless Local Area Network
WMM Wi-Fi Multi Media
WPA Wi-Fi Protected Access
Table 76. Abbreviations
…continued
Acronym Description
Table 77. Revision history
Document ID Release date Data sheet status Change notice Supersedes
BGW200EG_1 20070718 Product data sheet - -
BGW200EG_1 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 01 — 18 July 2007 74 of 76
NXP Semiconductors
BGW200EG
IEEE 802.11b System-in-Package
21. Legal information
21.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL
http://www.nxp.com.
21.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
21.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of a NXP Semiconductors product can reasonably be expected to
result in personal injury, death or severe property or environmental damage.
NXP Semiconductors accepts no liability for inclusion and/or use of NXP
Semiconductors products in such equipment or applications and therefore
such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at
http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
21.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
22. Contact information
For additional information, please visit: http://www.nxp.com
For sales office addresses, send an email to: salesaddresses@nxp.com
Document status
[1][2]
Product status
[3]
Definition
Objective [short] data sheet Development This document contains data from the objective specification for product development.
Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.
Product [short] data sheet Production This document contains the product specification.
BGW200EG_1 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 01 — 18 July 2007 75 of 76
continued >>
NXP Semiconductors
BGW200EG
IEEE 802.11b System-in-Package
23. Contents
1 General description . . . . . . . . . . . . . . . . . . . . . . 1
2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
2.1 General. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
2.2 Power management . . . . . . . . . . . . . . . . . . . . . 1
2.3 Radio transceiver . . . . . . . . . . . . . . . . . . . . . . . 2
2.4 Baseband hardware . . . . . . . . . . . . . . . . . . . . . 2
2.5 Software . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2.6 Reference . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
4 Ordering information. . . . . . . . . . . . . . . . . . . . . 3
5 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4
6 Pinning information. . . . . . . . . . . . . . . . . . . . . . 5
6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 6
7 Functional description . . . . . . . . . . . . . . . . . . . 9
7.1 General. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
7.2 Subblock overview . . . . . . . . . . . . . . . . . . . . . 10
8 SA2405 RF transceiver . . . . . . . . . . . . . . . . . . 11
9 SA2411 RF power amplifier. . . . . . . . . . . . . . . 13
10 SA2443A IEEE 802.11b medium access
controller and modem . . . . . . . . . . . . . . . . . . . 13
10.1 System configuration unit . . . . . . . . . . . . . . . . 13
10.2 Microcontroller subsystem . . . . . . . . . . . . . . . 15
10.3 Hardware medium access control layer . . . . . 16
10.4 WEP encryption and decryption coprocessor. 18
10.5 CCM encryption and decryption coprocessor. 18
10.6 General-purpose DMA engine . . . . . . . . . . . . 19
10.7 Physical layer transmitter . . . . . . . . . . . . . . . . 19
10.8 Physical layer receiver . . . . . . . . . . . . . . . . . . 20
10.9 RF interface . . . . . . . . . . . . . . . . . . . . . . . . . . 21
10.10 System timers. . . . . . . . . . . . . . . . . . . . . . . . . 22
10.11 Interrupt control unit . . . . . . . . . . . . . . . . . . . . 23
10.12 Universal asynchronous receiver transmitter . 24
10.13 Master/slave serial peripheral interface . . . . . 25
10.14 High-speed slave serial peripheral interface. . 26
10.14.1 SPI interface . . . . . . . . . . . . . . . . . . . . . . . . . . 27
10.14.2 Mailboxes and scratch registers . . . . . . . . . . . 27
10.14.3 DMA controller . . . . . . . . . . . . . . . . . . . . . . . . 28
10.14.4 Host SPI operations . . . . . . . . . . . . . . . . . . . . 28
10.14.4.1 Write register command . . . . . . . . . . . . . . . . . 28
10.14.4.2 Read register command . . . . . . . . . . . . . . . . . 28
10.14.4.3 Host-to-slave DMA transfer. . . . . . . . . . . . . . . 29
10.14.4.4 Slave-to-host DMA command sequence . . . . 29
10.14.5 SPI2 registers . . . . . . . . . . . . . . . . . . . . . . . . . 30
10.14.5.1 Register overview . . . . . . . . . . . . . . . . . . . . . . 30
10.14.5.2 Register details. . . . . . . . . . . . . . . . . . . . . . . . 30
10.15 Secure digital interface. . . . . . . . . . . . . . . . . . 35
10.15.1 Mailboxes and scratch registers. . . . . . . . . . . 36
10.15.2 DMA controller . . . . . . . . . . . . . . . . . . . . . . . . 36
10.15.3 SDIO host operations. . . . . . . . . . . . . . . . . . . 36
10.15.3.1 SDIO interface register access. . . . . . . . . . . . 36
10.15.3.2 Host-to-function 1 DMA transfer. . . . . . . . . . . 36
10.15.3.3 Function 1-to-host DMA transfer . . . . . . . . . . 36
10.15.4 SDIO registers . . . . . . . . . . . . . . . . . . . . . . . . 37
10.15.4.1 Register overview. . . . . . . . . . . . . . . . . . . . . . 37
10.15.4.2 Card common control registers . . . . . . . . . . . 38
10.15.4.3 Function basic registers . . . . . . . . . . . . . . . . . 43
10.15.4.4 Function 1 registers . . . . . . . . . . . . . . . . . . . . 44
10.16 General-purpose I/O unit . . . . . . . . . . . . . . . . 49
11 Limiting values . . . . . . . . . . . . . . . . . . . . . . . . 50
12 Recommended operating conditions . . . . . . 50
13 Static characteristics . . . . . . . . . . . . . . . . . . . 51
14 Dynamic characteristics. . . . . . . . . . . . . . . . . 53
14.1 Receiver. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
14.2 Transmitter . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
14.3 Clock and reset . . . . . . . . . . . . . . . . . . . . . . . 58
14.4 SPI1 interface. . . . . . . . . . . . . . . . . . . . . . . . . 59
14.5 SPI2 interface. . . . . . . . . . . . . . . . . . . . . . . . . 62
14.6 SDIO interface . . . . . . . . . . . . . . . . . . . . . . . . 63
15 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 65
16 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
16.1 Printed-circuit board. . . . . . . . . . . . . . . . . . . . 66
16.1.1 PCB footprint layout . . . . . . . . . . . . . . . . . . . . 66
16.1.1.1 Vias design. . . . . . . . . . . . . . . . . . . . . . . . . . . 67
16.1.2 PCB finish . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
16.1.3 Stencil design. . . . . . . . . . . . . . . . . . . . . . . . . 67
16.2 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68
16.2.1 Solder paste. . . . . . . . . . . . . . . . . . . . . . . . . . 68
16.2.2 Reflow profile . . . . . . . . . . . . . . . . . . . . . . . . . 68
16.3 Rework. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69
16.3.1 Component removal. . . . . . . . . . . . . . . . . . . . 69
16.3.2 Site redress . . . . . . . . . . . . . . . . . . . . . . . . . . 70
16.3.3 Solder paste application. . . . . . . . . . . . . . . . . 70
16.3.4 Repair. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70
17 Moisture sensitivity level . . . . . . . . . . . . . . . . 70
18 Chemical content . . . . . . . . . . . . . . . . . . . . . . 70
19 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 71
20 Revision history . . . . . . . . . . . . . . . . . . . . . . . 73
21 Legal information . . . . . . . . . . . . . . . . . . . . . . 74
21.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 74
21.2 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 74
21.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 74

BGW200EG/01,518

Mfr. #:
Manufacturer:
NXP Semiconductors
Description:
IC RF TXRX+MCU WIFI 68LFLGA
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

Products related to this Datasheet