IS42S32400D
Integrated Silicon Solution, Inc. — www.issi.com
1
Rev. F
03/03/09
Copyright © 2006 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any
time without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are
advised to obtain the latest version of this device specification before relying on any published information and before placing orders for products.
FEATURES
Clock frequency: 166, 143, 125, 100 MHz
Fully synchronous; all signals referenced to a
positive clock edge
Internal bank for hiding row access/precharge
Power supply
V
DD VDDQ
IS42S32400D 3.3V 3.3V
LVTTL interface
Programmable burst length
– (1, 2, 4, 8, full page)
Programmable burst sequence:
Sequential/Interleave
Auto Refresh (CBR)
Self Refresh with programmable refresh periods
4096 refresh cycles every 64 ms
Random column address every clock cycle
Programmable CAS latency (2, 3 clocks)
Burst read/write and burst read/single write
operations capability
Burst termination by burst stop and precharge
command
Available in Industrial Temperature
Available in 86-pin TSOP-II and 90-ball FBGA
Available in Lead-free
OVERVIEW
ISSI's 128Mb Synchronous DRAM achieves high-speed
data transfer using pipeline architecture. All inputs and
outputs signals refer to the rising edge of the clock
input.The 128Mb SDRAM is organized in 1Meg x 32 bit x 4
Banks.
4Meg x 32
128-MBIT SYNCHRONOUS DRAM
MARCH 2009
KEY TIMING PARAMETERS
Parameter -6 -7 Unit
Clk Cycle Time
CAS Latency = 3 6 7 ns
CAS Latency = 2 8 10 ns
Clk Frequency
CAS Latency = 3 166 143 Mhz
CAS Latency = 2 125 100 Mhz
Access Time from Clock
CAS Latency = 3 5.4 5.4 ns
CAS Latency = 2 6.5 6.5 ns
2
Integrated Silicon Solution, Inc. — www.issi.com
Rev. F
03/03/09
IS42S32400D
DEVICE OVERVIEW
The 128Mb SDRAM is a high speed CMOS, dynamic
random-access memory designed to operate in 3.3V VDD
and 3.3V VDDQ memory systems containing 134,217,728
bits. Internally configured as a quad-bank DRAM with a
synchronous interface. Each 33,554,432-bit bank is orga-
nized as 4,096 rows by 256 columns by 32 bits.
The 128Mb SDRAM includes an AUTO REFRESH MODE,
and a power-saving, power-down mode. All signals are
registered on the positive edge of the clock signal, CLK. All
inputs and outputs are LVTTL compatible.
The 128Mb SDRAM has the ability to synchronously burst
data at a high data rate with automatic column-address
generation, the ability to interleave between internal banks
to hide precharge time and the capability to randomly
change column addresses on each clock cycle during
burst access.
A self-timed row precharge initiated at the end of the burst
sequence is available with the AUTO PRECHARGE func-
tion enabled.
Precharge
one bank while accessing one of the
other three banks will hide the
precharge
cycles and provide
seamless, high-speed, random-access operation.
SDRAM
read and write accesses are burst oriented starting at
a selected location and continuing for a programmed num-
ber of locations in a programmed sequence. The registra-
tion of an ACTIVE command begins accesses, followed by
a READ or WRITE command. The ACTIVE command in
conjunction with address bits registered are used to select
the bank and row to be accessed (BA0, BA1 select the
bank; A0-A11 select the row). The READ or WRITE
commands in conjunction with address bits registered are
used to select the starting column location for the burst
access.
Programmable READ or WRITE burst lengths consist of 1,
2, 4 and 8 locations or full page, with a burst terminate
option.
CLK
CKE
CS
RAS
CAS
WE
A9
A8
A7
A6
A5
A4
A3
A2
A1
A0
BA0
BA1
A10
COMMAND
DECODER
&
CLOCK
GENERATOR
MODE
REGISTER
REFRESH
CONTROLLER
REFRESH
COUNTER
SELF
REFRESH
CONTROLLER
ROW
ADDRESS
LATCH
MULTIPLEXER
COLUMN
ADDRESS LATCH
BURST COUNTER
COLUMN
ADDRESS BUFFER
COLUMN DECODER
DATA IN
BUFFER
DATA OUT
BUFFER
DQM0 - DQM3
DQ 0-31
V
DD
/V
DDQ
V
ss
/V
ssQ
12
12
8
12
12
8
32
32 32
32
256
(x 32)
4096
4096
4096
ROW DECODER
4096
MEMORY CELL
ARRAY
BANK 0
SENSE AMP I/O GATE
BANK CONTROL LOGIC
ROW
ADDRESS
BUFFER
A11
4
FUNCTIONAL BLOCK DIAGRAM (FOR 1MX32X4 BANKS)
IS42S32400D
Integrated Silicon Solution, Inc. — www.issi.com
3
Rev. F
03/03/09
PIN CONFIGURATIONS
86 pin TSOP - Type II for x32
PIN DESCRIPTIONS
A0-A11 Row Address Input
A0-A7 Column Address Input
BA0, BA1 Bank Select Address
DQ0 to DQ31 Data I/O
CLK System Clock Input
CKE Clock Enable
CS Chip Select
RAS Row Address Strobe Command
CAS Column Address Strobe Command
V
DD
DQ0
V
DD
Q
DQ1
DQ2
V
SS
Q
DQ3
DQ4
V
DD
Q
DQ5
DQ6
V
SS
Q
DQ7
NC
V
DD
DQM0
WE
CAS
RAS
CS
A11
BA0
BA1
A10
A0
A1
A2
DQM2
V
DD
NC
DQ16
V
SS
Q
DQ17
DQ18
V
DD
Q
DQ19
DQ20
V
SS
Q
DQ21
DQ22
V
DD
Q
DQ23
V
DD
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
86
85
84
83
82
81
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
V
SS
DQ15
V
SS
Q
DQ14
DQ13
V
DD
Q
DQ12
DQ11
V
SS
Q
DQ10
DQ9
V
DD
Q
DQ8
NC
V
SS
DQM1
NC
NC
CLK
CKE
A9
A8
A7
A6
A5
A4
A3
DQM3
V
SS
NC
DQ31
V
DD
Q
DQ30
DQ29
V
SS
Q
DQ28
DQ27
V
DD
Q
DQ26
DQ25
V
SS
Q
DQ24
V
SS
WE Write Enable
DQM0-DQM3 x32 Input/Output Mask
VDD Power
Vss Ground
VDDQ Power Supply for I/O Pin
VssQ Ground for I/O Pin
NC No Connection

IS42S32400D-7T-TR

Mfr. #:
Manufacturer:
Description:
IC DRAM 128M PARALLEL 86TSOP II
Lifecycle:
New from this manufacturer.
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