1
Features
3.0V to 3.6V Read/Write
Burst Read Performance
–<
100 MHz (RAS Latency = 2, CAS Latency = 6), 10 ns Cycle Time
t
SAC
= 7 ns
–<
75 MHz (RAS Latency = 2, CAS Latency = 5), 13 ns Cycle Time
t
SAC
= 8 ns
–<
50 MHz (RAS Latency = 1, CAS Latency = 4), 20 ns Cycle Time
t
SAC
= 9 ns
MRS Cycle with Address Key Programs
RAS Latency (1 and 2)
CAS Latency (2 ~ 8)
Burst Length: 4, 8
Burst Type: Sequential and Interleaved
Word Selectable Organization
16 (Word Mode)/x 32 (Double Word Mode)
Sector Erase Architecture
Eight 256K Word or 128K Double Word (4-Mbit) Sectors
Independent Asynchronous Boot Block
8K x 16 Bits with Hardware Lockout
Fast Program Time
3-volt, 100 µs per Word/Double Word Typical
12-volt, 30 µs per Word/Double Word Typical
Fast Sector Erase Time
2.5 Seconds at 3 Volts
1.6 Seconds at 12 Volts
Low-power Operation
–I
CC
Read = 75 mA Typical
Input and Output Pin Continuity Test Mode Optimizes Off-board Programming
Package:
86-pin TSOP Type II with Off-center Parting Line (OCPL) for Improved Reliability
LVTTL-compatible Inputs and Outputs
Description
The AT49LD3200 or AT49LD3200B SFlash
is a synchronous, high-bandwidth Flash
memory fabricated with Atmel’s high-performance CMOS process technology and is
organized either as 2,097,152 x 16 bits (word mode) or as 1,048,576 x 32 bits (double
word mode), depending on the polarity of the WORD
pin (see Pin Function Descrip-
tion Table). Synchronous design allows precise cycle control. I/O transactions are
possible on every clock cycle. All operations are synchronized to the rising edge of the
system clock. The range of operating frequencies, programmable burst length and
programmable latencies allow the same device to be useful for a variety of high-band-
width, high-performance memory system applications.
The AT49LD3200B will automatically activate the Asynchronous Boot Block after
power-up, whereas with the AT49LD3200, the Asynchronous Boot Block can be acti-
vated through Mode Register Set.
The synchronous DRAM interface allows designers to maximize system performance
while eliminating the need to shadow slow asynchronous Flash memory into high-
speed RAM.
The 32-megabit SFlash device is designed to sit on the synchronous memory bus and
operate alongside SDRAM.
32-megabit
(1M x 32 or
2M x 16)
High-speed
Synchronous
Flash Memory
AT49LD3200
AT49LD3200B
SFlash
Rev. 1940B–FLASH–11/01
2
AT49LD3200(B)
1940B–FLASH–11/01
To maximize system manufacturing throughput the AT49LD3200(B) features high-
speed 12-volt program and erase options. Additionally, stand-alone programming cycle
time of individual devices or modules is optimized with Atmel’s unique input and output
pin continuity test mode.
Pin Configuration
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
86
85
84
83
82
81
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
VCC
DQ0
VCCQ
DQ16
DQ1
VSSQ
DQ17
DQ2
VCCQ
DQ18
DQ3
VSSQ
DQ19
MR
VCC
DQM
NC
CAS
RAS
CS
WORD
A12
A11
A10
A0
A1
A2
NC
VCC
NC
DQ4
VSSQ
DQ20
DQ5
VCCQ
DQ21
DQ6
VSSQ
DQ22
DQ7
VCCQ
DQ23
VCC
VSS
DQ31
VSSQ
DQ15
DQ30
VCCQ
DQ14
DQ29
VSSQ
DQ13
DQ28
VCCQ
DQ12
NC
VSS
NC
VPP
WE
CLK
CKE
A9
A8
A7
A6
A5
A4
A3
NC
VSS
NC
DQ27
VCCQ
DQ11
DQ26
VSSQ
DQ10
DQ25
VCCQ
DQ9
DQ24
VSSQ
DQ8
VSS
TSOP (Type II)
Top View
3
AT49LD3200(B)
1940B–FLASH–11/01
Pin Function Description
Pin Name Input Function
CLK System Clock Active on the rising edge to sample all inputs.
CS
Chip Select Disables or enables device operation by masking or enabling all inputs except
CLK and CKE.
CKE Clock Enable Masks system clock to freeze operation from the next clock cycle. CKE should be
enabled at least one cycle prior to new command. Disables input buffers for power-
down in standby mode.
A0 - A12 Address Row/column addresses are multiplexed on the same pins.
Row address: RA
0
~ RA
12
, Column address: CA
0
~ CA
6
(x32), CA
0
~ CA
7
(x16)
RAS Row Address Strobe Latches row addresses on the rising edge of the CLK with RAS low.
Enables row access.
CAS Column Address Strobe Latches column addresses on the rising edge of the CLK with CAS low.
Enables column access.
MR
Mode Register Set Enables mode register set with MR low. (Simultaneously CS, RAS and CAS are low).
DQ0 - DQ31 Data Input/Output Data input for program/erase. Data output for read.
VCC/VSS Power Supply/Ground Power and ground for the input buffers and the core logic.
VCCQ/VSSQ Data Output Power/Ground Power and ground for the output buffers.
WORD
x32/x16 Mode Selection Double word mode/word mode, depending on polarity of WORD pin (WORD = high,
double word mode; WORD
= low, word mode).
Should be set to the desired state during power-up and prior to any device operation.
DQM Data-out Masking Masks output operation when a complete burst is not required.
NC No Connection Not connected
WE
Write Enable Enables the chip to be written.
VPP Program/Erase Pin Supply Program/Erase power supply.

AT49LD3200-13TC

Mfr. #:
Manufacturer:
Microchip Technology / Atmel
Description:
NOR Flash 32M bit
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union