Package mechanical data M95160-x, M95080-x
42/49 Doc ID 8028 Rev 11
Figure 19. UFDFPN8 (MLP8) - 8-lead ultra thin fine pitch dual flat no lead, package
outline
1. Drawing is not to scale.
2. The central pad (the area E2 by D2 in the above illustration) is internally pulled to V
SS
. It must not be
connected to any other voltage or signal line on the PCB, for example during the soldering process.
Table 29. UFDFPN8 (MLP8) 8-lead ultra thin fine pitch dual flat package no lead
2 x 3 mm, data
Symbol
millimeters inches
(1)
1. Values in inches are converted from mm and rounded to 4 decimal digits.
Typ Min Max Typ Min Max
A 0.550 0.450 0.600 0.0217 0.0177 0.0236
A1 0.020 0.000 0.050 0.0008 0.0000 0.0020
b 0.250 0.200 0.300 0.0098 0.0079 0.0118
D 2.000 1.900 2.100 0.0787 0.0748 0.0827
D2 (rev MB) 1.600 1.500 1.700 0.0630 0.0591 0.0669
D2 (rev MC) 1.200 1.600 0.0472 0.0630
E 3.000 2.900 3.100 0.1181 0.1142 0.1220
E2 (rev MB) 0.200 0.100 0.300 0.0079 0.0039 0.0118
E2 (rev MC) 1.200 1.600 0.0472 0.0630
e 0.500 0.0197
K (rev MB) 0.800 0.0315
K (rev MC) 0.300 0.0118
L 0.300 0.500 0.0118 0.0197
L1 0.150 0.0059
L3 0.300 0.0118
eee
(2)
2. Applied for exposed die paddle and terminals. Exclude embedding part of exposed die paddle from
measuring.
0.080 0.0031
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