M95160-x, M95080-x Package mechanical data
Doc ID 8028 Rev 11 43/49
Figure 20. WLCSP-R 1.350 x 1.365 mm 0.4 mm pitch 8 bumps, package outline
1. Primary datum Z and seating plane are defined by the spherical crowns of the bump.
2. Drawing is not to scale.
3. Preliminary data.
Table 30. WLCSP-R 1.350 x 1.365 mm 0.4 mm pitch 8 bumps, package mechanical
data
(1)
1. Preliminary data.
Symbol
millimeters inches
(2)
2. Values in inches are converted from mm and rounded to 4 decimal digits.
Typ Min Max Typ Min Max
A 0.545 0.490 0.600 0.0193 0.0215 0.0236
A1 0.190 0.0075
A2 0.355 0.014
b
(3)
3. Dimension is measured at the maximum bump diameter parallel to primary datum Z.
0.270 0.240 0.300 0.0106 0.0094 0.0118
D 1.350 1.475 0.0531 0.0581
E 1.365 1.490 0.0537 0.0587
e 0.400 0.0157
e1 0.800 0.0315
F 0.282 0.0111
G 0.275 0.0108
N (total number of
terminals)
88
aaa 0.110 0.0043
eee 0.060 0.0024
1C_ME
Wafer back side
Side view
Bump side
Detail A
Rotated 90˚
Seating plane
(see note 1)
b
Orientation
reference
D
E
Orientation
reference
Detail A
e1
e
G
e
F
e1
321
C
B
A
A2
A
Bump
eee Z
A1
Z
aaa
(×4)
Package mechanical data M95160-x, M95080-x
44/49 Doc ID 8028 Rev 11
Figure 21. TSSOP8 – 8-lead thin shrink small outline, package outline
1. Drawing is not to scale.
Table 31. TSSOP8 – 8-lead thin shrink small outline, package mechanical data
Symbol
millimeters inches
(1)
1. Values in inches are converted from mm and rounded to 4 decimal digits.
Typ Min Max Typ Min Max
A 1.2 0.0472
A1 0.05 0.15 0.002 0.0059
A2 1 0.8 1.05 0.0394 0.0315 0.0413
b 0.19 0.3 0.0075 0.0118
c 0.09 0.2 0.0035 0.0079
CP 0.1 0.0039
D 3 2.9 3.1 0.1181 0.1142 0.122
e0.65- -0.0256- -
E 6.4 6.2 6.6 0.252 0.2441 0.2598
E1 4.4 4.3 4.5 0.1732 0.1693 0.1772
L 0.6 0.45 0.75 0.0236 0.0177 0.0295
L1 1 0.0394
α 0°
N8 8
TSSOP8AM
1
8
CP
c
L
EE1
D
A2A
α
eb
4
5
A1
L1
M95160-x, M95080-x Part numbering
Doc ID 8028 Rev 11 45/49
11 Part numbering
Table 32. Ordering information scheme
Example: M95160 W MN 6 T P /S
Device type
M95 = SPI serial access EEPROM
Device function
160 = 16 Kbit (2048 x 8)
080 = 8 Kbit (1024 x 8)
Operating voltage
blank = V
CC
= 4.5 to 5.5 V
W = V
CC
= 2.5 to 5.5 V
R = V
CC
= 1.8 to 5.5 V
F = V
CC
= 1.7 to 5.5 V
Package
MN = SO8 (150 mil width)
DW = TSSOP8
MB or MC
(1)
= UFDFPN8 (MLP8)
1. For M95080 only.
CS = WLCSP
(2)
2. Preliminary data.
Device grade
6 = Industrial temperature range, –40 to 85 °C.
Device tested with standard test flow
3 = Device tested with high reliability certified flow
(3)
.
Automotive temperature range (–40 to 125 °C)
3. ST strongly recommends the use of the Automotive Grade devices for use in an automotive environment.
The high reliability certified flow (HRCF) is described in the quality note QNEE9801. Please ask your
nearest ST sales office for a copy.
Option
blank = Standard packing
T = Tape and reel packing
Plating technology
G or P = ECOPACK® (RoHS compliant)
Process
(4)
4. The Process letter (/G or /S) applies only to Range 3 devices. For Range 6 devices, the process letters do
not appear in the Ordering Information but only appear on the device package (marking) and on the
shipment box. Please contact your nearest ST Sales Office. For more information on how to identify
products by the Process Identification Letter, please refer to AN2043: Serial EEPROM Device Marking.
/G or /S = F6SP36%

M95080-RMB6TG

Mfr. #:
Manufacturer:
STMicroelectronics
Description:
EEPROM 16 Kbit and 8 Kbit
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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