UJA1066_2 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 03 — 17 March 2010 6 of 70
NXP Semiconductors
UJA1066
High-speed CAN fail-safe system basis chip
The exposed die pad at the bottom of the package allows better dissipation of heat from
the SBC via the printed-circuit board. The exposed die pad is not connected to any active
part of the IC and can be left floating, or can be connected to GND for the best EMC
performance.
INH/LIMP 17 inhibit/limp-home output (BAT14 related, push-pull, default floating)
WAKE 18 local wake-up input (BAT42 related, continuous or cyclic sampling)
n.c. 19 not connected
V2 20 5 V voltage regulator output for CAN; connect a buffer capacitor to this pin
CANH 21 CANH bus line (HIGH in dominant state)
CANL 22 CANL bus line (LOW in dominant state)
GND 23 ground
SPLIT 24 CAN-bus common mode stabilization output
i.c. 25 internally connected; must be connected to pin BAT42 in the application
i.c. 26 internally connected; must be left open in the application
BAT14 27 14 V battery supply input
n.c. 28 not connected
SYSINH 29 system inhibit output; BAT42 related (e.g. for controlling external DC-to-DC
converter)
V3 30 unregulated 42 V output (BAT42 related; continuous output or Cyclic mode
synchronized with local wake-up input)
SENSE 31 fast battery interrupt / chatter detector input
BAT42 32 42 V battery supply input (connect this pin to BAT14 in 14 V applications)
Table 2. Pin description
…continued
Symbol Pin Description