SC16IS752IBS,128 Datasheet SC16IS752IPW,112, SC16IS762IBS,128, SC16IS762IPW,112 | P55-P57

Product data sheet Rev. 9 — 22 March 2012 55 of 60

NXP Semiconductors

SC16IS752; SC16IS762

Dual UART with I

C-bus/SPI interface, 64-byte FIFOs, IrDA SIR

• Process issues, such as application of adhesive and flux, clinching of leads, board

transport, the solder wave parameters, and the time during which components are

exposed to the wave

• Solder bath specifications, including temperature and impurities

17.4 Reflow soldering

Key characteristics in reflow soldering are:

• Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to

higher minimum peak temperatures (see Figure 39

) than a SnPb process, thus

reducing the process window

• Solder paste printing issues including smearing, release, and adjusting the process

window for a mix of large and small components on one board

• Reflow temperature profile; this profile includes preheat, reflow (in which the board is

heated to the peak temperature) and cooling down. It is imperative that the peak

temperature is high enough for the solder to make reliable solder joints (a solder paste

characteristic). In addition, the peak temperature must be low enough that the

packages and/or boards are not damaged. The peak temperature of the package

depends on package thickness and volume and is classified in accordance with

Table 40

and 41

Moisture sensitivity precautions, as indicated on the packing, must be respected at all

times.

Studies have shown that small packages reach higher temperatures during reflow

soldering, see Figure 39

Table 40. SnPb eutectic process (from J-STD-020C)

Package thickness (mm) Package reflow temperature (C)

Volume (mm

)

< 350  350

< 2.5 235 220

 2.5 220 220

Table 41. Lead-free process (from J-STD-020C)

Package thickness (mm) Package reflow temperature (C)

Volume (mm

)

< 350 350 to 2000 > 2000

< 1.6 260 260 260

1.6 to 2.5 260 250 245

> 2.5 250 245 245

Product data sheet Rev. 9 — 22 March 2012 56 of 60

NXP Semiconductors

SC16IS752; SC16IS762

Dual UART with I

C-bus/SPI interface, 64-byte FIFOs, IrDA SIR

For further information on temperature profiles, refer to Application Note AN10365

“Surface mount reflow soldering description”.

18. Appendix

18.1 Errata for Rev. E added 12 August 2011

18.1.1 IrDA wake-up

In Rev. D, the UART cannot wake up through RX pin once the UART is put to sleep by the

host.

18.1.2 Clearing of RX FIFO overflow

In Rev. D, once the receive FIFO overflows, the receive FIFO cannot be cleared with FIFO

reset command if the UART is continuously receiving data.

18.1.3 Interrupt priority encoder

When the edge of the IOR signal (an internal signal that reads IIR register) comes close to

the X1 clock that generates the interrupt, the value of the Interrupt Indication Register (IIR)

might not be correct. This issue might occur if the X1 clock is very slow and the host read

operation is very fast in response to the interrupt from the UART.

18.1.4 Time-out interrupt

If the host reads the receive FIFO at the at the same time as a time-out interrupt condition

happens, the host might read 0xCC (time-out) in the Interrupt Indication Register (IIR), but

bit 0 of the Line Status Register (LSR) is not set (means there is not data in the

receive FIFO). This is a conflict of the receive FIFO status when IIR = 0xCC (time-out), it

indicates that there are data in the receive FIFO, but LSR bit 0 = 0 indicates otherwise.

MSL: Moisture Sensitivity Level

Fig 39. Temperature profiles for large and small components

001aac844

temperature

time

minimum peak temperature

= minimum soldering temperature

maximum peak temperature

= MSL limit, damage level

peak

temperature

Product data sheet Rev. 9 — 22 March 2012 57 of 60

NXP Semiconductors

SC16IS752; SC16IS762

Dual UART with I

C-bus/SPI interface, 64-byte FIFOs, IrDA SIR

19. Abbreviations

20. Revision history

Table 42. Abbreviations

Acronym Description

CPU Central Processing Unit

DLL Divisor Latch LSB

DLH Divisor Latch MSB

FIFO First In, First Out

GPIO General Purpose Input/Output

C-bus Inter IC bus

IrDA Infrared Data Association

LCD Liquid Crystal Display

MIR Medium InfraRed

POR Power-On Reset

SIR Serial InfraRed

SPI Serial Peripheral Interface

SPR ScratchPad Register

UART Universal Asynchronous Receiver/Transmitter

Table 43. Revision history

Document ID Release date Data sheet status Change notice Supersedes

SC16IS752_SC16IS762 v.9 20120322 Product data sheet - SC16IS752_SC16IS762 v.8

Modifications:

• Table 6 “Summary of interrupt control functions”: IIR[5:0] for interrupt type “I/O pins”

corrected from “00 1110” to “11 0000'

SC16IS752_SC16IS762 v.8 20110901 Product data sheet - SC16IS752_SC16IS762 v.7

SC16IS752_SC16IS762 v.7 20080519 Product data sheet - SC16IS752_SC16IS762 v.6

SC16IS752_SC16IS762 v.6 20061219 Product data sheet - SC16IS752_SC16IS762 v.5

SC16IS752_SC16IS762 v.5 20061128 Product data sheet - SC16IS752_SC16IS762 v.4

SC16IS752_SC16IS762 v.4 20061013 Product data sheet - SC16IS752_SC16IS762 v.3

SC16IS752_SC16IS762 v.3 20060707 Product data sheet - SC16IS752_SC16IS762 v.2

SC16IS752_SC16IS762 v.2 20060330 Product data sheet - SC16IS752_SC16IS762 v.1

SC16IS752_SC16IS762 v.1 20060104 Product data sheet - -

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SC16IS752IBS,128

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UART Interface IC I2C/SPI-UARTBRIDGE

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SC16IS752IBS,128

SC16IS752IBS,128

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