System-on-Chip LH79524/LH79525
Data Sheet for Rev. A.1 Silicon Version 1.0 25
ADC and Brownout Detector
The ADC block consists of an 10-channel, 10-bit
Analog-to-Digital Converter with integrated Touch
Screen Controller (TSC). The complete touch screen
interface is achieved by combining the front-end bias-
ing, control circuitry with analog-to-digital conversion,
reference generation, and digital control.
The ADC has a bias-and-control network that allows
correct operation with both 4- and 5-wire touch panels.
A 16-entry × 16-bit wide FIFO holds a 10-bit ADC
output and a 4-bit tag number.
When the screen is touched, it pushes the conduc-
tive coating on the coversheet against the coating
on the glass, making electrical contact. The voltages
produced are the analog representation of the position
touched. The voltage level of the coversheet is
converted continuously by the ADC and monitored by
the system.
Other features include:
10-bit fully differential Successive Approximation
Register (SAR) with integrated sample/hold
A 10-channel multiplexer that routes user-selected
inputs to the ADC in single-ended and differential
modes
A 16-entry × 16-bit wide FIFO that holds the 10-bit
ADC output
Front bias-and-control network for touch screen
interface and support functions, which are compati-
ble with industry-standard 4- and 5-wire touch-sensi-
tive panels
Touch-pressure sensing circuits
Pen-down sensing circuit and interrupt generator
Independent voltage reference generator
Conversion automation function to minimize
interrupt overhead
Brownout Detector
Battery Control Signal.
ELECTRICAL SPECIFICATIONS
Absolute Maximum Ratings
NOTE: These stress ratings are only for transient conditions. Oper-
ation at or beyond absolute maximum rating conditions may
affect reliability and cause permanent damage to the device.
Recommended Operating Conditions
NOTES:
1. Linear Regulator disabled.
2. With PLL enabled. Without PLL, minimum frequency is 0 MHz.
Some peripherals may not operate at minimum frequency.
3. Choose 11.2896 MHz to ensure proper operation of the I
2
S, USB,
and UART peripherals.
4. Core Voltage should never exceed I/O Voltage after initial power
up. See “Power Supply Sequencing” on page 26.
PARAMETER SYMBOL RATING UNIT
DC Core Supply Voltage VDDC -0.3 to 2.4 V
DC I/O Supply Voltage VDD -0.3 to 4.6 V
DC Analog Supply
Voltage for ADC
VDDA0 -0.3 to 4.6 V
VDDA1 -0.3 to 2.4 V
VDDA2 -0.3 to 2.4 V
Storage Temperature TSTG -55 to +125 °C
PARAMETER MINIMUM TYPICAL MAXIMUM NOTES
DC Core Supply Voltage (VDDC) 1.7 V 1.8 V 1.9 V 1, 4
DC I/O Supply Voltage (VDD) 3.0 V 3.3 V 3.6 V 4
DC Analog Supply Voltage (VDDA0) 3.0 V 3.3 V 3.6 V
DC Analog Supply Voltage (VDDA1) 1.7 V 1.8 V 1.9 V
DC Analog Supply Voltage (VDDA2) 1.7 V 1.8 V 1.9 V
Clock Frequency 3.27 MHz 76.205 MHz 2
Crystal Frequency 10.0 MHz 11.2896 MHz 20.0 MHz 3
Operating Temperature (Industrial) -40°C 25°C +85°C
LH79524/LH79525 System-on-Chip
26 Version 1.0 Data Sheet for Rev. A.1 Silicon
Power Supply Sequencing
When the linear regulator is not enabled, SHARP
recommends that the 1.8 V power supply be energized
before the 3.3 V supply. If this is not possible, the 1.8 V
supply may not lag the 3.3 V supply by more than 100
μs. If longer delay time is needed, it is recommended
that the voltage difference between the two power sup-
plies be within 1.5 V during power supply ramp up. To
avoid a potential latchup condition, voltage should be
applied to input pins only after the device is powered-
on as described above.
DC/AC Specifications
Unless noted, all data provided are based on:
-40°C to +85°C (Industrial temperature range)
VDDC = 1.7 V to 1.9 V
VDD = 3.0 V to 3.6 V, VDDA = 1.7 V to 1.9 V.
DC SPECIFICATIONS
NOTES:
1. Table 2 details each pin’s buffer type.
2. Running Typical Application over operating range.
3. Current measured with CPU stopped and all peripherals enabled
Linear Regulator DC Characteristics.
SYMBOL PARAMETER MIN. TYP. MAX. UNIT CONDITIONS
VIH CMOS input HIGH voltage 2.0 5.5 V CEN = 1
VIL CMOS input LOW voltage 0.8 V CEN = 1
VIT+ Positive Input threshold voltage (Schmitt pins) 2.0 V CSEN = 1
VIT- Negative Input threshold voltage (Schmitt pins) 0.8 V CSEN = 1
VHYST Schmitt trigger hysteresis 0.35 V CSEN = 1
VOH
1
Output drive (2 mA type) 2.6 V IOH = -2 mA
Output drive (4 mA type) 2.6 V IOH = -4 mA
Output drive (8 mA type) 2.6 V IOH = -8 mA
Output drive (12 mA type) 2.6 V IOH = -12 mA
VOL
1
Output drive (2 mA type) 0.4 V IOL = 2 mA
Output drive (4 mA type) 0.4 V IOL = 4 mA
Output drive (8 mA type) 0.4 V IOL = 7 mA
Output drive (12 mA type) 2.6 V IOH = 12 mA
RIN Input leakage pull-up/pull-down resistors 40 kΩ
VIN = VDD or GND (Calculate input
leakage current at desired VDD)
IACTIVE Active current 85 mA Note 2
ISTANDBY Standby current 50 mA Notes 2, 3
ISLEEP Sleep current 3.8 mA
ISTOP1 Stop1 current 420 μA
ISTOP2 Stop2 current 115 μA RTC ON, Linear Regulator ON
ISTOP2 Stop2 current 95 μA RTC OFF, Linear Regulator ON
ISTOP2 Stop2 current 45 μA RTC ON, Linear Regulator OFF
ISTOP2 Stop2 current 25 μA RTC OFF, Linear Regulator OFF
SYMBOL PARAMETER MIN. TYP. MAX. UNIT
IQUIESCENT Quiescent Current 75 μA
ISLEEPLR Current with Linear Regulator disabled 8 μA
IOLR Output Current Range 0.0 200 mA
VOLR Output Voltage, Linear Regulator 1.84 V
System-on-Chip LH79524/LH79525
Data Sheet for Rev. A.1 Silicon Version 1.0 27
AC Test Conditions
Power Consumption By Peripheral Device
Table 12 shows the typical power consumption by
individual peripheral device.
AC Specifications
All signals described in Table 13 relate to transitions
after a reference clock signal. The illustration in Figure
7 represents all cases of these sets of measurement
parameters; except for the Asynchronous Memory
Interface — which are referenced to Address Valid.
The reference clock signals in this design are:
HCLK, the System Bus clock
PCLK, the Peripheral Bus clock (locked to HCLK in
the LH79524/LH79525)
SSPCLK, the Synchronous Serial Interface clock
UARTCLK, the UART Interface clock
LCDDCLK, the LCD Data clock from the
LCD Controller
and SDCLK, the SDRAM clock.
All signal transitions are measured from the 50%
point of the clock to the 50% point of the signal. See
Figure 7.
For outputs from the LH79524/LH79525, tOVXXX
(e.g. tOVA) represents the amount of time for the out-
put to become valid from the rising edge of the refer-
ence clock signal. Maximum requirements for tOVXXX
are shown in Table 13.
The signal tOHXXX (e.g. tOHA) represents the
amount of time the output will be held valid from the ris-
ing edge of the reference clock signal. Minimum
requirements for tOHXXX are listed in Table 13.
For Inputs, tISXXX (e.g. tISD) represents the
amount of time the input signal must be valid before the
rising edge of the clock signal. Minimum requirements
for tISXXX are shown in Table 13.
The signal tIHXXX (e.g. tIHD) represents the
amount of time the output must be held valid from the
rising edge of the reference clock signal. Minimum
requirements are shown in Table 13.
PARAMETER RATING UNIT
Supply Voltage (VDD) 3.0 to 3.6 V
Core Voltage (VDDC) 1.7 to 1.9 V
Input Pulse Levels VSS to VDD V
Input Rise and Fall Times 2 ns
Input and Output Timing
Reference Levels
VDD/2 V
Table 12. Peripheral Current Consumption
PERIPHERAL TYPICAL UNITS
ADC/TSC 590
μA
Counter/Timers 203 μA
DMA 4.2 mA
Ethernet Controller 670 μA
I
2
S 200 μA
LCD Controller 2.2 mA
RTC 5.1 μA
SSP 508 μA
UARTs 203
μA
USB Device (+PLL) 5.6 (+3.3) mA
Figure 7. LH79524/LH79525 Signal Timing
REFERENCE
CLOCK
OUTPUT
SIGNAL (O)
INPUT
SIGNAL (I)
tOVXXX
tOHXXX
tISXXX tIHXXX
LH79525-28

LH79524N0F100A0

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IC MCU 32BIT ROMLESS 208CABGA
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