TC58NVG1S3ETAI0
2012-09-01C
1
TOSHIBA MOS DIGITAL INTEGRATED CIRCUIT SILICON GATE CMOS
2 GBIT (256M × 8 BIT) CMOS NAND E
2
PROM
DESCRIPTION
The TC58NVG1S3E is a single 3.3V 2 Gbit (2,214,592,512 bits) NAND Electrically Erasable and Programmable
Read-Only Memory (NAND E
2
PROM) organized as (2048 + 64) bytes × 64 pages × 2048blocks.
The device has two 2112-byte static registers which allow program and read data to be transferred between the
register and the memory cell array in 2112-byte increments. The Erase operation is implemented in a single block
unit (128 Kbytes + 4 Kbytes: 2112 bytes × 64 pages).
The TC58NVG1S3E is a serial-type memory device which utilizes the I/O pins for both address and data
input/output as well as for command inputs. The Erase and Program operations are automatically executed making
the device most suitable for applications such as solid-state file storage, voice recording, image file memory for still
cameras and other systems which require high-density non-volatile memory data storage.
FEATURES
Organization
x8
Memory cell array 2112 × 128K × 8
Register 2112 × 8
Page size 2112 bytes
Block size (128K + 4K) bytes
Modes
Read, Reset, Auto Page Program, Auto Block Erase, Status Read, Page Copy,
Multi Page Program, Multi Block Erase, Multi Page Copy, Multi Page Read
Mode control
Serial input/output
Command control
Number of valid blocks
Min 2008 blocks
Max 2048 blocks
Power supply
V
CC
= 2.7V to 3.6V
Access time
Cell array to register 25 μs max
Serial Read Cycle 25 ns min (CL=100pF)
Program/Erase time
Auto Page Program 300 μs/page typ.
Auto Block Erase 2.5 ms/block typ.
Operating current
Read (25 ns cycle) 30 mA max.
Program (avg.) 30 mA max
Erase (avg.) 30 mA max
Standby 50 μA max
Package
TSOP I 48-P-1220-0.50 (Weight: 0.53 g typ.)
TC58NVG1S3ETAI0
2012-09-01C
2
PIN ASSIGNMENT (TOP VIEW)
PIN NAMES
I/O1 to I/O8 I/O port
CE Chip enable
WE Write enable
RE Read enable
CLE Command latch enable
ALE Address latch enable
WP Write protect
BY/RY Ready/Busy
V
CC
Power supply
V
SS
Ground
NC
NC
NC
NC
I/O8
I/O7
I/O6
I/O5
NC
NC
NC
V
CC
V
SS
NC
NC
NC
I/O4
I/O3
I/O2
I/O1
NC
NC
NC
NC
1 48
2 47
3 46
4 45
5 44
6 43
7 42
8 41
9 40
10 39
11 38
12 37
13 36
14 35
15 34
16 33
17 32
18 31
19 30
20 29
21 28
22 27
23 26
24 25
NC
NC
NC
NC
NC
NC
BY/RY
RE
CE
NC
NC
V
CC
V
SS
NC
NC
CLE
ALE
WE
WP
NC
NC
NC
NC
NC
×8×8
TC58NVG1S3ETAI0
TC58NVG1S3ETAI0
2012-09-01C
3
BLOCK DIAGRAM
ABSOLUTE MAXIMUM RATINGS
SYMBOL RATING VALUE UNIT
V
CC
Power Supply Voltage 0.6 to 4.6 V
V
IN
Input Voltage 0.6 to 4.6 V
V
I/O
Input /Output Voltage 0.6 to V
CC
+ 0.3 ( 4.6 V) V
P
D
Power Dissipation 0.3 W
T
SOLDER
Soldering Temperature (10 s) 260 °C
T
STG
Storage Temperature 55 to 150 °C
T
OPR
Operating Temperature -40 to 85 °C
CAPACITANCE
*
(Ta
=
25°C, f
=
1 MHz)
SYMB0L PARAMETER CONDITION MIN MAX UNIT
C
IN
Input V
IN
= 0 V 10 pF
C
OUT
Output V
OUT
= 0 V 10 pF
* This parameter is periodically sampled and is not tested for every device.
I/O
Control circuit
Status register
Command register
Column buffer
Column decoder
Data register
Sense amp
Memory cell array
Control circuit
HV generator
Row address decoder
Logic control
BY/RY
V
CC
I/O1
V
SS
I/O8
CE
CLE
ALE
WE
RE
BY/RY
Row address buffer
decoder
to
WP
Address register

TC58NVG1S3ETAI0

Mfr. #:
Manufacturer:
Toshiba Memory
Description:
NAND Flash 3.3V 2Gb 43nm SLC NAND (EEPROM)
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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