PCA9665N,112 Datasheet PCA9665N,112 | P85-P87

Product data sheet Rev. 03 — 12 August 2008 85 of 90

NXP Semiconductors

PCA9665

Fm+ parallel bus to I

C-bus controller

• Process issues, such as application of adhesive and ﬂux, clinching of leads, board

transport, the solder wave parameters, and the time during which components are

exposed to the wave

• Solder bath speciﬁcations, including temperature and impurities

17.4 Reﬂow soldering

Key characteristics in reﬂow soldering are:

• Lead-free versus SnPb soldering; note that a lead-free reﬂow process usually leads to

higher minimum peak temperatures (see Figure 50) than a SnPb process, thus

reducing the process window

• Solder paste printing issues including smearing, release, and adjusting the process

window for a mix of large and small components on one board

• Reﬂow temperature proﬁle; this proﬁle includes preheat, reﬂow (in which the board is

heated to the peak temperature) and cooling down. It is imperative that the peak

temperature is high enough for the solder to make reliable solder joints (a solder paste

characteristic). In addition, the peak temperature must be low enough that the

packages and/or boards are not damaged. The peak temperature of the package

depends on package thickness and volume and is classiﬁed in accordance with

Table 54 and 55

Moisture sensitivity precautions, as indicated on the packing, must be respected at all

times.

Studies have shown that small packages reach higher temperatures during reﬂow

soldering, see Figure 50.

Table 54. SnPb eutectic process (from J-STD-020C)

Package thickness (mm) Package reﬂow temperature (°C)

Volume (mm

)

< 350 ≥ 350

< 2.5 235 220

≥ 2.5 220 220

Table 55. Lead-free process (from J-STD-020C)

Package thickness (mm) Package reﬂow temperature (°C)

Volume (mm

)

< 350 350 to 2000 > 2000

< 1.6 260 260 260

1.6 to 2.5 260 250 245

> 2.5 250 245 245

Product data sheet Rev. 03 — 12 August 2008 86 of 90

NXP Semiconductors

PCA9665

Fm+ parallel bus to I

C-bus controller

For further information on temperature proﬁles, refer to Application Note

AN10365

“Surface mount reﬂow soldering description”

18. Soldering of through-hole mount packages

18.1 Introduction to soldering through-hole mount packages

This text gives a very brief insight into wave, dip and manual soldering.

Wave soldering is the preferred method for mounting of through-hole mount IC packages

on a printed-circuit board.

18.2 Soldering by dipping or by solder wave

Driven by legislation and environmental forces the worldwide use of lead-free solder

pastes is increasing. Typical dwell time of the leads in the wave ranges from

3 seconds to 4 seconds at 250 °C or 265 °C, depending on solder material applied, SnPb

or Pb-free respectively.

The total contact time of successive solder waves must not exceed 5 seconds.

The device may be mounted up to the seating plane, but the temperature of the plastic

body must not exceed the speciﬁed maximum storage temperature (T

stg(max)

). If the

printed-circuit board has been pre-heated, forced cooling may be necessary immediately

after soldering to keep the temperature within the permissible limit.

18.3 Manual soldering

Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the

seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is

less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is

between 300 °C and 400 °C, contact may be up to 5 seconds.

MSL: Moisture Sensitivity Level

Fig 50. Temperature proﬁles for large and small components

001aac844

temperature

time

minimum peak temperature

= minimum soldering temperature

maximum peak temperature

= MSL limit, damage level

peak

temperature

Product data sheet Rev. 03 — 12 August 2008 87 of 90

NXP Semiconductors

PCA9665

Fm+ parallel bus to I

C-bus controller

18.4 Package related soldering information

[1] For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit

board.

[2] For PMFP packages hot bar soldering or manual soldering is suitable.

19. Abbreviations

20. Revision history

Table 56. Suitability of through-hole mount IC packages for dipping and wave soldering

Package Soldering method

Dipping Wave

CPGA, HCPGA - suitable

DBS, DIP, HDIP, RDBS, SDIP, SIL suitable suitable

[1]

PMFP

[2]

- not suitable

Table 57. Abbreviations

Acronym Description

ASIC Application Speciﬁc Integrated Circuit

CDM Charged Device Model

CPU Central Processing Unit

DSP Digital Signal Processing

DUT Device Under Test

ESD ElectroStatic Discharge

HBM Human Body Model

C-bus Inter-Integrated Circuit bus

I/O Input/Output

MM Machine Model

PCB Printed-Circuit Board

RC Resistor-Capacitor network

SMBus System Management Bus

Table 58. Revision history

Document ID Release date Data sheet status Change notice Supersedes

PCA9665_3 20080812 Product data sheet - PCA9665_2

Modiﬁcations:

• Table 12 “I2CCON - Control register (A1 = 1, A0 = 1) bit description”, description of STO: second

paragraph re-written

• Section 7.3.2.2 “The Own Address register, I2CADR (indirect address 01h)”:

– deleted (old) 3

sentence and added (new) 3

and 4

sentences

– added second “Remark” statement

• Table 24 “I2CMODE - I

C-bus Mode register (indirect address 06h) bit description”, description of

AC[1:0]: added reference to

Table 51.

• Section 8.11 “Reset”: added 4 paragraphs following Figure 18, and added (new) Figure 19.

PCA9665_2 20061207 Product data sheet - PCA9665_1

PCA9665_1 20060807 Objective data sheet - -

PCA9665N,112

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