Philips Semiconductors Product data sheet
SC28L202Dual UART
2005 Nov 01
55
GENERAL TIMING CONSIDERATIONS FOR THE SC28L202
This part is designed to operate in both the Intel (80xxx) and Motorola (68000) environments. When the Motorola mode is used, the definition,
function, polarity and timing of some pins change. See Figure 3 on page 61.
ABSOLUTE MAXIMUM RATINGS
1
SYMBOL
PARAMETER RATING UNIT
T
amb
Operating ambient temperature range
2
Note 4 °C
T
stg
Storage temperature range –65 to +150 °C
V
CC
Voltage from V
CC
to GND
3
–0.5 to +7.0 V
V
SS
Voltage from any pin to GND
3
–0.5 to V
CC
+0.5 V
P
D
Maximum power dissipation (TSSOP56) 2.4 W
R
th(j-c)
Thermal resistance, junction to case (TSSOP56) 20 W/°C
R
th(j-a)
Thermal resistance, junction to ambient (TSSOP56) 83 W/°C
NOTES:
1. Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only and
functional operation of the device at these or any other condition above those indicated in the operation section of this specification is not
implied.
2. For operating at elevated temperatures, the device must be derated based on + 150_C maximum junction temperature.
3. This product includes circuitry specifically designed for the protection of its internal devices from damaging effects of excessive static
charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying any voltages larger than the rated maxima.
4. Parameters are valid over specified temperature range.
DC ELECTRICAL CHARACTERISTICS
1,
2,
3
(NOMINAL 5 V)
V
CC
= 5 V ± 10%; T
amb
= – 40 °C to +85 °C, unless otherwise specified
SYMBOL
PARAMETER TEST CONDITIONS
LIMITS
UNIT
Min Typ Max
V
IL
Input low voltage – – 0.8 V
V
IH
Input high voltage (except X1/SCLK) –40 °C to +85 °C 2.4 – – V
V
IH
Input high voltage (X1/SCLK) 0.8*V
CC
– – V
V
OL
Output low voltage I
OL
= 4 mA – – 0.4 V
V
OH
Output high voltage (except open drain outputs)
4
I
OH
= –400 µA V
CC
– 0.5 – – V
I
IX1PD
X1/SCLK input current – power-down V
IN
= 0 to V
CC
–1 – 1 µA
I
ILX1
X1/SCLK input low current – operating V
IN
= 0 V –30 – 0 µA
I
IHX1
X1/SCLK input high current – operating V
IN
= V
CC
0 – 30 µA
Input leakage current
Ii Input port and IACKN pins
5
V
IN
= 0 to V
CC
–10 – 1 µA
All other pins
5
V
IN
= 0 to V
CC
–1 – 1 µA
I
OZH
Output off current high, 3–State data bus V
IN
= V
CC
– – 5 µA
I
OZL
Output off current low, 3–State data bus V
IN
= 0 V –5 – – µA
I
ODL
Open–drain output low current in off–state V
IN
= 0 V –10 – – µA
I
ODH
Open–drain output high current in off–state V
IN
= V
CC
– – 1 µA
Power supply current
6
I
CC
Operating mode CMOS input levels; freq. = 10 MHz – 9 20 mA
Power-down mode CMOS input levels; freq. = 0 MHz – 200 500 µA
NOTES:
1. Parameters are valid over specified temperature range.
2. All voltage measurements are referenced to ground (GND). For testing, all inputs swing between 0.4 V and 3.0 V with a transition time of
5 ns maximum. For X1/SCLK this swing is between 0.4 V and 4.4 V. All time measurements are referenced at input voltages of 0.8 V and
2.0 V and output voltages of 0.8 V and 2.0 V, as appropriate.
3. Typical values are at +25 °C, typical supply voltages, and typical processing parameters.
4. Test conditions for outputs: C
L
= 85 pF, except interrupt outputs. Test conditions for interrupt outputs: C
L
= 85 pF, R
L
= 2.7 kΩ to V
CC
.
5. I/O port and IACKN pins have active pull-up transistors that will source a typical 2 µA from V
CC
when they are at V
SS
. At V
CC
they
source 0.0 µA.
6. All outputs are disconnected. Inputs are switching between CMOS levels of V
CC
– 0.2 V and V
SS
+ 0.2 V.