SC28L92_7 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 07 — 19 December 2007 55 of 73
NXP Semiconductors
SC28L92
3.3 V/5.0 V Dual Universal Asynchronous Receiver/Transmitter
[1] The following conditions apply:
a) Parameters are valid over specified temperature and voltage range.
b) All voltage measurements are referenced to ground. For testing, all inputs swing between 0.4 V and 3.0 V with a transition time of
5 ns maximum. For X1/CLK this swing is between 0.4 V and 0.8V
CC
. All time measurements are referenced at input voltages of 0.8 V
and 2.0 V, and output voltages of 0.8 V and 2.0 V, as appropriate.
c) Test conditions for outputs: C
L
= 125 pF, except open-drain outputs. Test conditions for open-drain outputs: C
L
= 125 pF,
constant current source = 2.6 mA.
d) Typical values are the average values at +25 °C and 5 V.
[2] Timing is illustrated and referenced to the WRN and RDN Inputs. Also, CEN may be the strobing input. CEN and RDN (also CEN and
WRN) are ORed internally. The signal asserted last initiates the cycle and the signal negated first terminates the cycle.
[3] Guaranteed by characterization of sample units.
[4] If CEN is used as the strobing input, the parameter defines the minimum HIGH times between one CEN and the next. The RDN signal
must be negated for t
RWD
to guarantee that any status register changes are valid.
[5] Minimum frequencies are not tested but are guaranteed by design.
[6] Clocks for 1× mode should maintain a 60/40 duty cycle or better.
Clock timing (see Figure 17)
t
CLK
X1/CLK HIGH or LOW time 30 20 - ns
f
CLK
X1/CLK frequency
[5]
0.1 3.686 8 MHz
t
CTC
C/T clock (IP2) HIGH or LOW time (C/T
external clock input)
30 10 - ns
f
CTC
C/T clock (IP2) frequency
[5]
0- 8MHz
t
RX
RxC HIGH or LOW time 16× 30 10 - ns
f
RX
RxC frequency 16× 0 - 16 MHz
1×
[5][6]
0- 1MHz
t
TX
TxC HIGH or LOW time 16× 30 10 - ns
f
TX
TxC frequency 16× --16MHz
1×
[5][6]
0- 1MHz
Transmitter timing, external clock (see
Figure 18)
t
TXD
TxD output delay from TxC LOW (TxC
input pin)
- 4060ns
t
TCS
output delay from TxC output pin LOW to
TxD data output
- 6 30 ns
Receiver timing, external clock (see
Figure 19)
t
RXS
RxD data set-up time to RxC HIGH 50 40 - ns
t
RXH
RxD data hold time from RxC HIGH 50 40 - ns
68xxx or Motorola bus timing (see
Figure 12, 13 and 14)
[7]
t
DCR
DACKN LOW (read cycle) from X1 HIGH
[7]
- 1535ns
t
DCW
DACKN LOW (write cycle) from X1 HIGH - 15 35 ns
t
DAT
DACKN high-impedance from CEN or
IACKN HIGH
- 8 10 ns
t
CSC
CEN or IACKN set-up time to X1 HIGH for
minimum DACKN cycle
16 8 - ns
Table 67. Dynamic characteristics, 5 V operation
[1]
…continued
V
CC
= 5.0 V
±
10 %, T
amb
=
40
°
C to +85
°
C, unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
SC28L92_7 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 07 — 19 December 2007 56 of 73
NXP Semiconductors
SC28L92
3.3 V/5.0 V Dual Universal Asynchronous Receiver/Transmitter
[7] Minimum DACKN time is ((t
DCR
or t
DCW
)t
CSC
+ 2 X1 edges + rise time over 5 ns). Two X1 edges is 273 ns at 3.6864 MHz. For faster bus
cycles, the 80xxx bus timing may be used while in the 68xxx mode. It is not necessary to wait for DACKN to insure the proper operation
of the SC26C92. In all cases the data will be written to the SC28L92 on the falling edge of DACKN or the rise of CEN. The fall of CEN
initializes the bus cycle. The rise of CEN ends the bus cycle. DACKN LOW or CEN HIGH completes the write cycle.
Table 68. Dynamic characteristics, 3.3 V operation
[1]
V
CC
= 3.3 V
±
10 %, T
amb
=
40
°
C to +85
°
C, unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
Reset timing (see
Figure 10)
t
RES
reset pulse width 100 20 - ns
Bus timing
[2]
(see Figure 11)
t
AS
A0 to A3 set-up time to RDN, WRN LOW 10 6 - ns
t
AH
A0 to A3 hold time from RDN, WRN LOW 33 16 - ns
t
CS
CEN set-up time to RDN, WRN LOW 0 - - ns
t
CH
CEN hold time from RDN, WRN LOW 0 - - ns
t
RW
WRN, RDN pulse width (LOW time) 20 10 - ns
t
DD
data valid after RDN LOW 125 pF load; see Figure 9
for smaller loads
- 4675ns
t
DA
RDN LOW to data bus active
[3]
0--ns
t
DF
data bus floating after RDN or CEN HIGH - 15 20 ns
t
DI
RDN or CEN HIGH to data bus invalid
[4]
0--ns
t
DS
data bus set-up time before WRN or CEN
HIGH (write cycle)
43 20 - ns
t
DH
data hold time after WRN HIGH 0 15 - ns
t
RWD
HIGH time between read and/or write
cycles
[2][4]
27 10 - ns
Port timing
[2]
(see Figure 15)
t
PS
port in set-up time before RDN LOW
(Read IP ports cycle)
0 20 - ns
t
PH
port in hold time after RDN HIGH 0 20 - ns
t
PD
OP port valid after WRN or CEN HIGH
(OPR write cycle)
- 5075ns
Interrupt timing (see
Figure 16)
t
IR
INTRN (or OP3 to OP7 when used as
interrupts)
read Rx FIFO
(RxRDY/FFULL interrupt)
- 4079ns
write Tx FIFO (TxRDY
interrupt)
- 4079ns
reset command (delta
break change interrupt)
- 4079ns
stop C/T command
(counter/timer interrupt
- 4079ns
read IPCR (delta input port
change interrupt)
- 4079ns
write IMR (clear of change
interrupt mask bit(s))
- 4079ns
SC28L92_7 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 07 — 19 December 2007 57 of 73
NXP Semiconductors
SC28L92
3.3 V/5.0 V Dual Universal Asynchronous Receiver/Transmitter
[1] The following conditions apply:
a) Parameters are valid over specified temperature and voltage range.
b) All voltage measurements are referenced to ground. For testing, all inputs swing between 0.4 V and 3.0 V with a transition time of
5 ns maximum. For X1/CLK this swing is between 0.4 V and 0.8V
CC
. All time measurements are referenced at input voltages of 0.8 V
and 2.0 V, and output voltages of 0.8 V and 2.0 V, as appropriate.
c) Test conditions for outputs: C
L
= 125 pF, except open-drain outputs. Test conditions for open-drain outputs: C
L
= 125 pF,
constant current source = 2.6 mA.
d) Typical values are the average values at +25 °C and 3.3 V.
[2] Timing is illustrated and referenced to the WRN and RDN Inputs. Also, CEN may be the strobing input. CEN and RDN (also CEN and
WRN) are ORed internally. The signal asserted last initiates the cycle and the signal negated first terminates the cycle.
[3] Guaranteed by characterization of sample units.
[4] If CEN is used as the strobing input, the parameter defines the minimum HIGH times between one CEN and the next. The RDN signal
must be negated for t
RWD
to guarantee that any status register changes are valid.
[5] Minimum frequencies are not tested but are guaranteed by design.
[6] Clocks for 1× mode should maintain a 60/40 duty cycle or better.
Clock timing (see Figure 17)
t
CLK
X1/CLK HIGH or LOW time 35 25 - ns
f
CLK
X1/CLK frequency
[5]
0.1 3.686 8 MHz
t
CTC
C/T clock (IP2) HIGH or LOW time (C/T
external clock input)
30 15 - ns
f
CTC
C/T clock (IP2) frequency
[5]
0- 8MHz
t
RX
RxC HIGH or LOW time 16× 30 10 - ns
f
RX
RxC frequency 16× 0 - 16 MHz
1×
[5][6]
0- 1MHz
t
TX
TxC HIGH or LOW time 16× 30 15 - ns
f
TX
TxC frequency 16× --16MHz
1×
[5][6]
0- 1MHz
Transmitter timing, external clock (see
Figure 18)
t
TXD
TxD output delay from TxC LOW (TxC
input pin)
- 4078ns
t
TCS
output delay from TxC output pin LOW to
TxD data output
- 8 30 ns
Receiver timing, external clock (see
Figure 19)
t
RXS
RxD data set-up time to RxC HIGH 50 10 - ns
t
RXH
RxD data hold time from RxC HIGH 50 10 - ns
68xxx or Motorola bus timing (see
Figure 12, 13 and 14)
[7]
t
DCR
DACKN LOW (read cycle) from X1 HIGH
[7]
- 1857ns
t
DCW
DACKN LOW (write cycle) from X1 HIGH - 18 57 ns
t
DAT
DACKN high-impedance from CEN or
IACKN HIGH
- 1015ns
t
CSC
CEN or IACKN set-up time to X1 HIGH for
minimum DACKN cycle
30 10 - ns
Table 68. Dynamic characteristics, 3.3 V operation
[1]
…continued
V
CC
= 3.3 V
±
10 %, T
amb
=
40
°
C to +85
°
C, unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit

SC28L92A1BS,551

Mfr. #:
Manufacturer:
NXP Semiconductors
Description:
IC UART DUAL W/FIFO 48HVQFN
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New from this manufacturer.
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