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Tsi721
Datasheet
April 4, 2016
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Tsi721 Datasheet 2 April 4, 2016
Integrated Device Technology
Table of Contents
About this Document......................................................................................................................6
Overview....................................................................................................................................................................................................6
Document Conventions..............................................................................................................................................................................6
Revision History......................................................................................................................................................................................... 7
1. Device Overview............................................................................................................................ 8
1.1 Overview....................................................................................................................................................................................................8
1.2 Features.....................................................................................................................................................................................................8
1.2.1 PCIe Features ............................................................................................................................................................................8
1.2.2 S-RIO Features ..........................................................................................................................................................................9
1.2.3 Bridging Features.......................................................................................................................................................................9
1.2.4 Messaging Features.................................................................................................................................................................10
1.2.5 Block DMA Engine Features ....................................................................................................................................................10
1.2.6 Miscellaneous Features.............................................................................................................................................................11
1.3 Block Diagram..........................................................................................................................................................................................12
1.3.1 PCIe Interface...........................................................................................................................................................................12
1.3.2 S-RIO Interface.........................................................................................................................................................................12
1.3.3 Messaging Engine....................................................................................................................................................................12
1.3.4 Mapping Engine........................................................................................................................................................................12
1.3.5 Block DMA Engine....................................................................................................................................................................12
1.4 Typical Applications ................................................................................................................................................................................. 13
1.4.1 Defense/Aerospace Application ...............................................................................................................................................13
1.4.2 Video and Imaging Application.................................................................................................................................................15
1.4.3 Wireless Application.................................................................................................................................................................15
2. Signals ......................................................................................................................................... 17
2.1 Overview..................................................................................................................................................................................................17
2.2 Ballmap....................................................................................................................................................................................................18
2.3 Pinlist ....................................................................................................................................................................................................... 19
2.4 PCIe Signals............................................................................................................................................................................................19
2.5 S-RIO Signals..........................................................................................................................................................................................20
2.6 General Signals .......................................................................................................................................................................................20
2.7 I2C Signals .............................................................................................................................................................................................. 21
2.8 JTAG and Test Interface Signals..............................................................................................................................................................21
2.9 GPIO Signals...........................................................................................................................................................................................22
2.10 Power-up Signals.....................................................................................................................................................................................23
2.11 Power Supply Signals..............................................................................................................................................................................26
3. Electrical Characteristics........................................................................................................... 27
3.1 Absolute Maximum Ratings.....................................................................................................................................................................27
3.2 Recommended Operating Conditions......................................................................................................................................................28
3.3 Power Consumption................................................................................................................................................................................. 28
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Tsi721 Datasheet 3 April 4, 2016
Integrated Device Technology
3.4 Power Supply Sequencing....................................................................................................................................................................... 29
3.4.1 Power-Up Sequencing..............................................................................................................................................................29
3.4.2 Power-Down Sequencing.........................................................................................................................................................29
3.5 DC Operating Characteristics..................................................................................................................................................................30
3.6 Decoupling Recommendation.................................................................................................................................................................. 31
3.7 AC Timing Specifications.........................................................................................................................................................................31
3.7.1 PCIe Differential Receiver Specifications.................................................................................................................................31
3.7.2 PCIe Differential Transmitter Specifications.............................................................................................................................34
3.7.3 RapidIO SerDes Characteristics............................................................................................................................................... 38
3.7.4 Level I Long Run Transmitter Specifications............................................................................................................................ 43
3.7.5 Reference Clocks – PCCLKP/N and REFCLKP/N...................................................................................................................57
3.7.6 JTAG and Test Interface Signal Timings .................................................................................................................................. 59
3.7.7 I2C Interface Signal Timings ....................................................................................................................................................60
3.7.8 GPIO Interface Signal Timings................................................................................................................................................. 61
3.7.9 RSTn Signal Timings................................................................................................................................................................61
4. Package Specifications............................................................................................................... 62
4.1 Package Dimensions...............................................................................................................................................................................62
4.2 Package Diagrams................................................................................................................................................................................... 63
4.3 Thermal Characteristics........................................................................................................................................................................... 64
4.4 Moisture Sensitivity.................................................................................................................................................................................. 64
5. Ordering Information................................................................................................................... 65

TSI721A1-16GILV

Mfr. #:
Manufacturer:
IDT
Description:
PCI Interface IC PCIe-to-Rapid IO Bridge
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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