Panasonic, a worldwide leader in semiconductor products, announces the FJ3P02100L and FK3P02110L series of power CSP MOSFETs. The power CSP MOSFET series features Power Mount CSP Packaging (PMCP) that is comprised of a unique pad design and drain clip technology. This allows for a 5% improvement in thermal dissipation while simultaneously reducing the size by 80% over the conventional solutions. Panasonic’s advances in cell technology and wafer thinning fabrication have led to silicon with a 110 nm fine trench cell that provides 47% lower RDS(on) over the same sized conventional chip. By using this technology, this MOSFET series achieves higher power efficiency while reducing power consumption.
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