The K32 L2 MCUs are based on the Arm Cortex-M0+ core and feature multiple low-power modes.
MMA8491Q Xtrinsic 3-axis accelerometer is an ultra-low-power tamper detection and tilt sensor that enables many functions.
NXP’s PCT2075 temperature sensor offers more flexibility boasting a ±1°C precision over a -25°C to +100°C range, where most temperature measurements are made.
NXP introduces the FXLN83xxQ 3-axis, low-power, low-g analog-output accelerometers.
NXP's PCT2202 is an I²C bus, serial-output temperature sensor available in a tiny WLCSP6 package.
NXP Semiconductors' PCT2075 is a temperature-to-digital converter featuring ±1°C max accuracy over -25°C to +100°C range.
QorIQ P2 Platform delivers dual- and single-core frequencies up to 1.2GHz on a 45nm technology low-power platform.
NXP's QorIQ P1 Platform is designed for power-conscious, high-performance applications, offering the value of integration in a 3 W power envelope.
Tower Mechatronic Board kit includes simple development tools that will help you learn to write software for sensors.
NXP's LPC4300 series combines high-performance, low-power ARM Cortex-M4 and ARM Cortex-M0 cores with a unique set of configurable peripherals.
As a leader in high performance mixed-signal IC products, NXP offers an extensive selection of high-speed data converters, with digital interfaces.
Delivering robust USB performance at a low cost, the LPC11U Cortex-M0 USB devices from NXP are compelling replacements for 8- and 16-bit USB MCUs.
Platforms offering an easy-to-use mass-storage device mode flash programmer, a virtual serial port, and classic programming and run-control capabilities.
The NXP Semiconductors family of low voltage GPIO with Agile I/O expands the two wires of the I²C-bus into 8 or 16 general purpose I/O.
NXP Semiconductors' GreenChip controller ICs are highly efficient solutions designed for LED lighting.
NXP's TFA988 is a mono, filter-free class-D audio amplifier in a 9-bump wafer level chip-size package (WLCSP) with a 400 μm pitch.
NXP Semiconductors introduces logic plastic packages. The ultra-compact packaging design is ideal for leading-edge portable handheld devices.
The next-generation MCU solution offering ESD/EMC performance for cost-sensitive, high-reliability device applications used in high electrical noise environments.
NXP's 32-bit core offers system enhancements such as low power consumption, enhanced debug features, and a high level of support-block integration.
FRDM-KL26Z is an ultra-low-cost development platform for Kinetis L series KL16 and KL26 MCUs built on ARM® Cortex™-M0+ processors.