Microsemi's PolarFire evaluation kit offers high-performance evaluation across a broad class of applications.
Configurable analog, large flash memory blocks, comprehensive clock generation and management circuitry are integrated into the Actel Fusion FPGAs from Microsemi.
Microsemi SoC's SmartFusion evaluation kit can communicate via Ethernet and HyperTerminal and features FPGA with hard ARM Cortex-M3 and programmable analog.
Microsemi SoC's SmartFusion2 SoC FPGAs feature 166 MHz ARM® Cortex™-M3 with on chip eSRAM and eNVM in a low-power, high-security programmable logic solution.
A ProASIC3 starter kit board, a Libero Gold software license, and a FlashPro4 programmer are included in the ProASIC3 starter kit from Microsemi SoC.
Microsemi’s SmartFusion®2 SoC-FPGA-based solution has algorithms like sensorless FOC, FOC with HALL, FOC with encoder, and FOC with resolver for PMSM/BLDC motors.
Microsemi's PolarFire® FPGAs deliver up to 50% lower power than equal SRAM FPGAs and are ideal for a wide range of applications.
Microsemi’s SmartFusion®2 Maker Board, available exclusively at Digi-Key, provides designers with the lowest cost board to access the SmartFusion2 SoC FPGA.
Microsemi's PolarFire Splash Kit provides general purpose interfaces for evaluation and development.
Microsemi's PolarFire™ video and imaging kit offers high-performance 4K image processing and rendering with dual camera sensors.
Microsemi's IGLOO® low-power Flash FPGA family offers a single-chip solution and small footprint packages making the devices ideal for portable electronics.
Microsemi's ProASIC®3 family of FPGAs offer performance, density, and features beyond those of the ProASICPLUS® family.
Microsemi’s ProASICPLUS® low-power FPGAs combine the advantages of ASICs with the benefits of programmable devices through nonvolatile Flash technology.
Microsemi SoC's SmartFusion cSoCs integrate an FPGA, ARM Cortex-M3, and programmable logic and also offer more flexibility than traditional fixed-function microcontrollers.
Microsemi's IGLOO®2 FPGAs offer up to 5 times more logic density and 3 times more fabric performance than its predecessors.