SP3012 TVS Diode Arrays Compact Form-Factors

By Littelfuse Inc 138

SP3012 TVS Diode Arrays Compact Form-Factors

The SP3012 integrates 3, 4, or 6 channels of ultra-low capacitance rail-to-rail diodes and an additional zener diode to provide protection for electronic equipment that may experience destructive electrostatic discharges (ESD). These robust devices can safely absorb repetitive ESD strikes above the maximum level specified in the IEC61000-4-2 international standard (±8 kV contact discharge) without performance degradation. Their extremely low loading capacitance also makes them ideal for protecting high-speed signal lines such as USB3.0, HDMI, USB2.0, and eSATA. Products within the SP3012 series have been qualified to AEC-Q101 and are appropriate for use in automotive applications.

USB 3.0 Circuit ESD Protection Application Note

Features Applications
  • ESD, IEC61000-4-2, ±12 kV contact, ±25 kV air
  • EFT, IEC61000-4-4, 40 A (tP=5/50ns)
  • Lightning, IEC61000-4-5, 4 A (tP=8/20μs)
  • Low capacitance of 0.5 pF (TYP) per I/O
  • Low leakage current of 1.5 μA (MAX) at 5 V
  • External storage devices
  • DVD/Blu-ray players
  • Desktops
  • MP3/PMP
  • Set-top boxes
  • Smartphones
  • Ultrabooks/notebooks
  • Digital cameras
  • Automotive