Today’s wearable sports applications require higher than the common ±2000 dps (degrees per second) FSR so that critical data is not lost at the point of impact. The ±4000 dps range of the InvenSense's ITG-3701 enables precise analysis of a golf or tennis racquet swing, and soccer ball and basketball applications providing continuous data before, during, and after impact. The InvenSense ITG-3701 directly addresses the wearable sports market technology requirements with lowest-power consumption of only 5.9 mW (3.3 mA at 1.8 V), extending battery life and an industry first 0.75 mm height.

Other industry-leading features include on-chip 16-bit ADC, programmable digital filters, a precision clock with 1% variation from -40°C to 85°C, an embedded temperature sensor and programmable interrupts. Parts are available with a fast-mode I²C serial interface, a VDD operating range of 1.71 to 3.6 V, and a VDDIO voltage from 1.71 V to 3.6 V.

By leveraging its patented and volume-proven InvenSense Fabrication platform, which integrates MEMS wafers with companion CMOS electronics through wafer-level bonding, InvenSense has driven the ITG-3701 package size down to a footprint of 3 x 3 x 0.75 mm (QFN), while providing the highest-performance, lowest-noise, and the lowest-cost semiconductor packaging to address a wide-range of consumer electronic devices. The device provides the highest-robustness by supporting 10,000 g shock in operation. The highest-cross-axis isolation is achieved by design from its single-silicon integration.