Ideal for tight packaging constraints, Molex's low-profile SolderRight Direct-Solder Terminals enable right-angle connections to a PCB at a low applied cost. Right-angle mounting orientation provides super-low-profile solder options for wires exiting a PCB (much lower than a "solder and bend" operation that many customers use). Solder pins positioned between the insulation and conductor crimps offer superior wire strain relief and resist terminal and solder-joint breakage if a wire is pulled. Multiple terminal/wire size ranges (14 to 28 AWG) are available. They enable signal-to-power current capability while optimizing PCB space. The twin solder pins provide unmatched stability for solder processing and allow redundant current paths.