Molex delivers industry-leading signal integrity and density while providing a scalable price and performance path for future data-rate enhancements. The Impelsystem of backplane connectors and customized cable assemblies offers OEMs the option for equipment to operate at today’s data rates and costs.

Leading the datacom computing markets with high data-rate and high-density solutions, the Impel backplane interconnect system provides a scalable price-for-performance solution, enabling customers to secure a high-speed 25 and 40 Gbps footprint.

Molex continues to lead development in the backplane and cable assembly market through innovative connector products. Customers are currently designing new high-end system architectures that will require data-rate improvements. The Impel backplane interconnect system provides the footprint and interface that will enable customers to migrate to faster data rates (40 Gbps), without completely re-designing their architecture or replacing hardware already placed in the data-center, while meeting the mechanical density requirements being driven by the industry.