Molex's 3rd generation C-Grid III 2.54 mm pitch post and receptacle interconnection system offers complete design flexibility and modular components that provide the widest range of electronic packaging alternatives. C-Grid III is a highly-versatile 2.54 mm interconnection system offering unique design features:

Surface Treatment: C-Grid III is available in 3 standard platings. Two performance levels of selective gold and one of tin, all over a nickel-plated substrate, guarantee the optimum ration of quality versus cost of your application.

Flexibility: C-Grid III has been developed to meet the latest industry requirements. Three different termination techniques, solder tail, crimp, and insulation displacement, are combined in a complete interconnection system which is based on north/south contact orientation. Headers will accept both discrete wire and ribbon cable connectors.

Advantage by Design: C-Grid III box contact design employs the same mating concept with all termination techniques. A uniform locking system on all contacts allows full interchangeability inside different housing styles.

Interchangeability: C-Grid III is fully-compatible with the industry standard DIN41651 as well as the French norm HE-13/14. Moreover, it is fully-intermateable/interchangeable with Molex's QF-50 product range.

Lower Applied Cost: C-Grid III system incorporates a wide range of advanced application tooling, from manually-operated hand tools to semi-automatic harness making machines. C-Grid III offers the widest range of interconnection packaging alternatives in the electric market today.

• Pitch:
• 2.54 mm
• Current:
  • 3.0 A max
• Circuits:
• 1 to 80