Mill-Max has developed a series of ultra-low- and low-profile spring pins for applications where above board height is limited. As packaging requirements for electronics continue to shrink in size, traditional interconnects do not always fit the bill. For board-to-board or device-to-board connections, low-profile spring pins are a practical solution.

Mill-Max has five low-profile spring pins to choose from that provide unique above PCB height profiles and through-hole or SMT options. The 0921-X and 0926-X series are through-hole mount and have either .0195” (0.5 mm) or .0275” (0.7 mm) mid-stroke travel. The 0965 is for surface-mount applications and has .012” (0.3 mm) mid-stroke travel.

These low-profile options maintain the quality and reliability of current Mill-Max spring pins by utilizing the same technology and internal spring components. Gold-plated components and springs ensure the highest conductivity, corrosion resistance, and durability. All three pins are rated for one million cycles and have a current rating of 2 A continuous use (3 A maximum.)

The pins are supplied in bulk as standard packaging. For applications requiring a single- or double-row strip or custom layout of pins, other packaging options are available. The 0926-X and 0965 pins can be mounted into machined Fr-4 epoxy insulators while the 0921-X pins can be supplied on removable Kapton tape.