Toshiba has launched its TLP3406S, a photorelay in the industry's smallest 2 mm × 1.45 mm (typical), S-VSON4 package. Compared to previous products in a 2.45 mm × 1.45 mm (typical), VSON4 package, this photorelay has an approximately 22.5% smaller mounting area. This can contribute to the development of smaller test boards and also make it possible to increase the number of photorelays on a board to increase density. Since the photorelay can drive large currents of up to 1.5 A, in spite of its small package, it can be used in device power supplies (DPS) that make up the power-supply circuits in various testers. As a further plus point, the high operating temperature rating has been enhanced from 85°C to 110°C. Typical applications are in automatic test equipment (ATE), semiconductor testers (memory, SoC, and LSI), and probe cards.