SmartBond™ DA14586 Bluetooth® 5 SoC

By Dialog Semiconductor 80

SmartBond™ DA14586 Bluetooth® 5 SoC

Connected devices are constantly evolving. New generations appear that are smarter, more full featured, and have longer battery lifetimes. To enable this, SmartBond has evolved too. Dialog Semiconductor's DA14586 offers designers all the benefits of the industry-leading DA14580 but with even greater flexibility to create more advanced applications from the smallest footprints and power budgets.

As part of the Dialog SmartBond family, the DA14586 is the smallest, lowest power, and most integrated Bluetooth solution available. This versatile SoC is ideal for adding Bluetooth low energy to products like remote controls, proximity tags, beacons, connected medical devices, and smart home nodes. It supports all Bluetooth developments up to and including Bluetooth 5 and Bluetooth low energy Mesh. Plus, with 2 Mb of Flash memory and 96 kB of RAM, the DA14586 has double the memory for user applications than its predecessor to take full advantage of the standard’s features. It also includes an integrated microphone interface for voice support at low additional cost.

Like all SmartBond solutions, the DA14586 is easy to design-in and supports standalone as well as hosted applications. It is supported by a complete development environment and Dialog’s SmartSnippets™ software that helps users optimize their software for power consumption. For highly cost sensitive applications, the family also offers the SmartBond DA14585 with integrated one-time-programmable memory as an alternative to Flash memory.

SmartBond DA14586 Bluetooth 5 SoC Block Diagram
SmartBond DA14586 Product Brief

Features

  • Complies with Bluetooth 5.0, ETSI EN 300 328 and EN 300 440 Class 2 (Europe), FCC CFR47
  • Part 15 (US) and ARIB STD-T66 (Japan)
  • Processing units
    • 16 MHz 32-bit ARM® Cortex®-M0 with SWD interface
    • Dedicated Link Layer Processor
    • AES-128-bit encryption Processor
  • Memories
    • 2 Mb Flash memory
    • 64 kB one-time-programmable (OTP) memory
    • 96 kB data/retention SRAM
    • 128 kB ROM operating system and protocol stack
  • Power management
    • Integrated buck DC-DC converter
    • P0, P1, P2, and P3 ports with 3.3 V tolerance
    • Easy decoupling of only foursupply pins
    • Supports coin and alkaline battery cells
    • 1.8 V cold boot support-buck mode
    • 10-bit ADC for battery voltage measurement
  • Digital controlled oscillators
    • 16 MHz crystal (±20 ppm max) and RC oscillator
    • 32 kHz crystal (±50 ppm)
    • RCX oscillator (±500 ppm max)

  • Supports up to eight Bluetooth LE connections
  • Fast cold boot in less than 50 ms
  • Flexible reset circuitry
    • System and power on reset in a single pin
  • General purpose, capture and sleep timers
    • Digital interfaces
    • Gen. purpose I/Os: 24 (QFN40)
    • Two UARTs with hardware flow control maximum data rate 1.0 Mbps
    • SPI+™ interface
    • I²C bus at 100 kHz, 400 kHz
    • 3-axes capable quadrature decoder
  • Analog interfaces
    • 4-channel 10-bit ADC
  • Radio transceiver
    • Fully integrated 2.4 GHz CMOS transceiver
    • Single wire antenna: no RF matching or RX/TX switching required
    • Current consumption with supply voltage equal 3 V
    • TX: 3.4 mA, RX: 3.7 mA (with ideal DC-DC)
    • +0 dBm transmit output power
    • -20 dBm output power in ‘Near Field Mode’
    • -93 dBm receiver sensitivity
  • Packages:
    • QFN 40-pins, 5 mm x 5 mm x 0.9 mm
Applications

  • Remote controls
  • Proximity tags and trackers
  • Beacons
  • Connected medical devices
  • Smart home

  • Human interface devices
  • VR controllers
  • Connected sensors
  • Wireless charging

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