The robust HSAutoLink II interconnect system from Molex delivers data rates up to 5 Gbps, supporting high-speed media protocols including USB 3.1 (5 Gb/s data rate), to meet increasing bandwidth requirements for advanced in-vehicle infotainment, telematics, and camera devices. It optimizes device-side space savings to meet future needs for increasing high-speed communication links.
| Videos |
- Creating New Opportunities for Infotainment Architecture
- HSAutoLink
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| Electrical |
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- Voltage (max.): 36 V
- Current (max.): 1.5 A (higher current rating achievable)
- Contact resistance: 20 milliohms
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- Dielectric withstanding voltage: 500 VAC
- Insulation resistance (min.): 100 Megohms
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| Mechanical |
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- Insertion force to PCB (max.): 20 N
- Mating force (max.): 75 N
- Unmating force (max.): 75 N
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- Connector: 25 cycles
- Terminal system: 5000 cycles
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| Applications |
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- Automotive and commercial vehicles
- Infotainment
- Telematics devices
- Navigation systems
- Connected vehicle services
- Diagnostics or data up-loading for flashing ECUs
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- Advanced driver assistance system (ADAS)
- Multiple cameras for around vehicle view monitoring, lane departure, pedestrian warning, night vision, loading/unloading operations, and more
- Camera-to-controller/controller-to-display connections
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