Amphenol's HPCE connector is a next-generation power card edge connector for demanding applications requiring high linear current density and low power loss. HPCE offers a low-profile height (7.50 mm) and is based on very cost effective and highly reliable stamped-and-formed power contact technology similar to other power solutions from FCI.

The HPCE incorporates an innovative power contact and housing design that permits a more compact and lower profile package for both demanding AC and DC power supply and add-in card applications. HPCE's low profile height (for maximized airflow), significantly increased linear current density, and low contact resistance characteristics are ideal for next generation 1U/2U servers, storage enclosures, telecommunications equipment, and datacom/networking equipment.

HPCE is available with power and signal contacts integrated into a single molded housing for power distribution and power control. Similar to other FCI power solutions, HPCE is modularly tooled making the product highly configurable in terms of the number and placement of the power and signal contacts for custom power needs.

HPCE is rated to 9 A per power contact beam (with multiple power contacts fully energized) without exceeding a 30°C temperature rise in still air. The innovative design minimizes the connector footprint, and the robust housing includes touch-proof safety features as well as polarization to ensure proper mating. Vertical, right angle, and straddle mount options are available to accommodate various system architectures.