Molex's all-in-one modular triad wafer configuration offers space savings and fully configurable press-fit technology. The modular NeoPress high-speed mezzanine system enables design flexibility on space-constrained PCBs with tunable differential pairs, low stack heights, and compliant-pin terminations while offering data rates up to 28 Gbps. As evolving telecommunication, industrial automation, and medical applications demand higher speeds and smaller form factors, designers need to maximize PCB real estate without sacrificing performance. The NeoPress high-speed mezzanine system’s modular design achieves both high- and low-speed signals at 28 Gbps with tunable differential pairs (between 85 Ohms or 100 Ohms). Designers need only one connector for different speeds; therefore, they create space savings on the PCB.

SMT connectors are permanently affixed, making it virtually impossible to reuse PCBs. When an SMT termination fails, attempting to rework it creates a short. Even though PCBs are expensive and being able to reuse them would create cost savings, designers are reluctant to use press-fit mezzanine connectors because they typically offer lower signal integrity than SMT. The NeoPress high-speed mezzanine system has been engineered to provide compliant-pin termination while minimizing near-end and far-end crosstalk to match the signal integrity of the NeoScale SMT connector. The compliant pin enables designers to rework the board when necessary and maximize its use without having to sacrifice signal integrity.

A versatile and economical solution, the NeoPress high-speed mezzanine system provides compliant-pin termination while minimizing near-end and far-end crosstalk to match the signal integrity of popular SMT connectors. The triad wafer technology provides dedicated differential pairs to accommodate power and chip impedance requirements. The NeoPress system addresses engineering challenges in system envelopes. Unlike standard wafer-style mezzanine connectors, which are generally limited to two or four pair configurations, the NeoPress design takes a unique approach allowing customers multiple configurations in a single connector. The high-speed triad wafers comprise three pins per differential pair — two signal pins and one shielded ground pin — to provide standalone 28 Gbps fully shielded differential pairs with dedicated grounds. This means designers need only one connector for different speeds, which creates space savings on the PCB.